PCB dervos medžiagos įtrūkimų priežastys po BGA pagalvėlėmis SMTP apdorojimo metu
Reasons For PCB Resin Material Cracking Under BGA Pads During SMTP Processing Cracking of PCB resin material occurs due to the presence of entrapped moisture. The reason for this is a high soldering temperature that results in an increase in vapor pressure. The cracks can also occur because the board’s thermal expansion causes the spacing […]