Kokia yra PCB Via Hole funkcija ir principas?

PCB via skylė - tai atvira skylė, išgręžta PCB. Skylės sienelė padengta dengiamuoju tirpalu, kuris leidžia elektros signalams tekėti per skylę. Gręžiant skylę svarbu laikytis gamintojo taisyklių, kad būtų užtikrintas tinkamas skersmuo ir kraštinių santykis. Taip pat reikia laikytis mažiausio atstumo tarp gretimų vidinių angų.

Per skylutę išvedžiotos skylės

PCB per skylutes einančios pertvaros paprastai naudojamos signalų perėjimams spausdintinėse plokštėse. Yra įvairių tipų perėjimų, įskaitant akluosius perėjimus, palaidotus perėjimus ir mikroperėjimus. Kiekvienam pralaidų tipui reikalinga tam tikra procedūra. Šios jungtys įrengiamos projektavimo proceso maršruto parinkimo etape ir gali būti įrengiamos rankiniu būdu arba automatiškai naudojant EDA programinę įrangą. Laikantis PCB pralaidų projektavimo taisyklių, spausdintinė plokštė gali būti pagaminta pagal tikslias jai reikalingas specifikacijas.

PCB per skylutes einančių angų principas ir paskirtis - nukreipti signalą nuo pado. Paprastai tai daroma naudojant litavimo kaukę. Taip išvengiama lydmetalio pastos patekimo į praėjimą, o tai gali lemti jungties gedimus. Tačiau jei pralaidumas yra pado gręžimo skylėje, ant pralaidumo negalima naudoti lydmetalio kaukės, todėl kyla patikimumo problema montuojant.

Užkastos vidinės linijos

Įterptos vidinės linijos naudojamos siekiant padidinti spausdintinių plokščių grandynų skaičių nedidinant plokštės dydžio ar svorio. Jos gaminamos naudojant kitokį procesą nei standartinė dvipusė spausdintinė plokštė. Skirtingai nei kitų tipų laidai, jie nedaro poveikio paviršinio montavimo komponentams ar pėdsakams.

Užkasti laidai dažnai naudojami dėl konstrukcinių priežasčių, įskaitant komponentų tankio reikalavimų laikymąsi. Jos taip pat sumažina plokštės dydį, tačiau šis procesas taip pat reikalauja daugiau tikslių patikrinimų ir gamybos proceso etapų. Be to, palaidotų jungčių gamyba yra pigesnė, tačiau šiam projektui turėtumėte pasitelkti patikimą elektronikos sutartinės gamybos partnerį.

Microvias

Mikrovamzdeliai - tai mažo skersmens skylutės, kurios yra padengtos danga. Jos naudojamos siekiant padidinti laidų tankį ir kartu sumažinti plokščių sluoksnių skaičių. Mikrolaidai taip pat sumažina per skylutes einančių skylučių poreikį ir leidžia sumažinti bendrą plokštelių dydį. Jos taip pat yra vienas iš ekonomiškiausių laidų tankio didinimo būdų. Šiame straipsnyje daugiausia dėmesio skiriama mikrolaidų privalumams ir tam, kaip jos gali padėti jums geriau įgyvendinti projektą.

Mikrovamzdeliai naudojami skylėms spausdintinėje plokštėje sumažinti. Jų skersmuo gali būti iki 15 um. Šis metodas reikalauja daugiau laiko ir pastangų, tačiau turi didelių privalumų. Mikrojuostelės taip pat užtikrina geresnį signalų vientisumą, nes jų jungčių keliai yra trumpesni, o parazitinis induktyvumas mažesnis.

Anilinijinis žiedas

PCB via skylė - tai per visus PCB sluoksnius išgręžta ir variu padengta skylė, skirta elektriniam sujungimui. Ši skylė yra cilindro formos ir plono skersmens. Jos skersmuo ir stiprumas priklauso nuo ją supančios varinės kaladėlės skersmens.

PCB sandūros gali būti pagamintos iš įvairių medžiagų. Medžiagos, naudojamos perėjoms, dažnai gaminamos iš įvairių metalų. Įprastai laidai gaminami iš vario arba epoksidinės medžiagos. Naudojant via-in-padus sumažinamas PCB plotas, todėl plokštės yra mažesnės. Tačiau ši praktika gali kelti rūpesčių, nes lituojant gali būti užpildytos via skylės. Todėl rekomenduojama kuo rečiau naudoti via-in-padus.

Patikimumas

Projektuojant spausdintinę plokštę svarbu atsižvelgti į tai, kiek patikima yra PCB pralaidumo anga. Jei ji neveikia patikimai, gali kilti patikimumo problemų. Patikimumo problemų taip pat gali kilti dėl lydmetalio nutekėjimo į tarpinę angą. Šis internetinis seminaras padės jums suprasti, kodėl svarbus PCB skylių patikimumas, ir pasiūlys keletą sprendimų.

Plokštelės spausdintinės plokštės skylės patikimumas priklauso nuo jos dydžio. Skiriami du pagrindiniai skylių tipai: aklosios skylės ir užkastos skylės. Abi jos yra svarbios signalų vientisumui, nes mažina triukšmą ir elektromagnetinę spinduliuotę bei padeda išvengti įtrūkimų ir išsisluoksniavimo. Apskritai PCB pralaidumo skylės dydis turėtų būti nuo šešių iki 150 mikrometrų.

Privalumai

PCB pralaidų skylės - tai puikus būdas užtikrinti jūsų spausdintinių plokščių patikimumą. Jomis galima dengti spausdintinę plokštę, nesulaikant joje oro ar kitų skysčių. Naudodami šį metodą galite padidinti savo spausdintinių plokščių patikimumą ir pagerinti surinkimo našumą. Šis procesas taip pat labai veiksmingas, nes padeda sumažinti tuštumų atsiradimo riziką.

Populiarus signalų perdavimo būdas - PCB via hole technologija. Taikant šį metodą varinės trinkelės dedamos tiesiai ant pralaidos, užuot nutiesus signalo pėdsaką nuo komponento varinio paviršiaus. Šis procesas taip pat sumažina erdvę, reikalingą trasoms tiesti. Šis metodas dažniausiai naudojamas BGA komponentams, kurių žingsnis yra 0,5 mm ir mažesnis. Naudojant šią technologiją sumažėja signalų kelių ilgis ir talpa bei parazitinis induktyvumas.

Su kokiomis problemomis dažniausiai susiduriama dėl SMT pėdsako?

SMT footprint is widely used for implementing microcontrollers. However, there are several problems related to SMT. Here are the common ones: Insufficient solder, thermal imbalances, and misplacement of components. These problems can also be caused by faulty part name, library name, and footprint.

Misplacement of components

If a component is dropped rather than placed on a surface mount footprint, the result can be a faulty PCB. In this case, a modification is necessary to the design to ensure that all parts are visible from above. In such a case, AOI may be used to detect the fault before the reflow process begins.

A bad placement of SMT components can lead to poor performance and even board failure. It is very important to place parts according to the schematics in order to avoid these problems. It is also important to keep analog and digital components separated and allow for clear signal return paths on the reference plane.

Thermal imbalances

SMT footprints can be a problem because they do not allow the proper amount of solder to reach the in-circuit test points. This can lead to poor solder joints, especially if the component is wave-solderable. However, this issue can be avoided by properly building the PCB footprint. To do this, it is important to remember to create the pads of the part to be large enough to contain solder paste. When the pads are too small, too much solder may flow over to another pad, causing bridging. This can be caused by improperly created pads or solder paste masks. It can also happen if the parts are placed too close together.

Another problem with smt footprints is the uneven amount of copper on both sides of the footprint. This can lead to component misplacement and thermal imbalance. In order to avoid this problem, PCBs should have a balanced copper distribution. It is also important to have the proper reflow profile to reduce delta T. This will also improve the surface finish of the PCB. The presence of moisture trapped within the component can also lead to thermal imbalances. Hence, PCBs should be stored in a humidity cabinet or pre-baked before use.

Insufficient solder

SMT footprint problems occur due to excess solder, which can flow into the wrong places during the soldering process. This can cause shorts or electrical problems. It also makes the solder look dull. Excess solder can also be caused by improper design, with pads and traces being too small or thin.

Often, SMT parts placed too close to in-circuit test points interfere with the ability of the test probes to make contact. Another common problem with SMT parts is that larger components may be placed in front of the smaller ones, causing shadowing. Designers should place smaller components in front of the larger components to avoid this problem.

Insufficient solder can cause poor strength and weak joints. Insufficient wetting can also lead to a metal oxide layer on the bonded object. Solder paste must be properly applied to both the pads and the pins to ensure that the joint will remain strong.

Pad-to-pin mismatch

A problem with pad-to-pin mismatch in SMT footprint can lead to insufficient solder. This problem can cause a circuit board to be rejected from a manufacturer. There are several ways to avoid it. First, always use the right footprint library. It will help you select the right size of component pads. Secondly, keep in mind that the distance between the pad edge and the silkscreen must be the same.

Second, an incorrectly matched pad is likely to result in impedance mismatch. The problem can occur at a number of locations, including board-to-board connectors, AC coupling capacitors, and cable-to-board connectors.

Spausdintinių plokščių prototipų kūrimo procesas

A printed circuit board (PCB) prototyping process involves a series of steps, starting with the creation of a PCB design. These steps include generating the required through holes and using carbide drill bits or NC drill machines to create the holes. Once the through holes have been created, a thin layer of copper is chemically deposited into the through holes. This copper layer is then thickened through electrolytic copper plating.

Gerber file

A Gerber file is a file with detailed descriptions of components. These files are often used to help with the debugging process and to create printed circuit boards. To make sure that your Gerber file contains the correct information, you should check that it is free from errors by using a tool like FreeDFM. It is also a good idea to submit a plain text file if you need to include additional information that is not included in the Gerber file. You should also provide the correct mapping file and matching files, which are required by PCB manufacturers to produce your PCB.

You can use several software applications to create PCB Gerber files, including PCB designer software. Another option is to use an experienced PCB manufacturer to create the Gerber file for you.

Silkscreen

Traditionally, the Silkscreen printed circuit board prototyping process has relied on stencils to apply markings on a circuit board. These stencils are similar to the ones that are used when spray painting a car’s number plate. However, PCB development has progressed since that time and silkscreen application methods have improved as well. With silkscreen printing, epoxy ink is pushed through the stencil to create the desired text or imagery. The ink is then baked into a laminate. However, this method has its drawbacks and is not ideal for high-resolution printing.

Once the silkscreen is complete, the fabricator will use the silk screen information to make a transfer screen and transfer the information to the PCB. Alternatively, the fabricator may also choose to use the more modern method of printing directly on the PCB without a transfer screen.

Reflow oven

A reflow oven is a type of oven that uses infrared light to melt the solder paste and assemble the components of a printed circuit board. This type of oven has several advantages. The process speed is adjustable and the temperature of each zone can be independently controlled. PCBs are fed into the oven by conveyor at a controlled rate. Technicians adjust the speed, temperature, and time profile depending on the needs of the PCB.

The first step in the reflow soldering process is to apply solder paste to the surface mount pads of the components. The solder paste holds the components in place while the components are soldered. Various types of solder paste are available. Choosing the type that is right for your needs will be an important decision.

Reflow

The reflow process is a common technique used in printed circuit board prototyping. It uses a solder paste to hold together the various components on the board. When the components are soldered together, they become electrically connected. The process begins by pre-heating the units, following a temperature profile that will remove volatile solvents from the solder paste.

The temperature is crucial for a quality solder joint. The reflow process must be completed within a reasonable time. Insufficient heat will result in ineffective joints, while excessive heat will damage the circuit board components. Generally, the reflow time ranges from 30 to 60 seconds. However, if the reflow time is too long, the solder will not reach its melting point and may result in brittle joints.

Reflow oven for four-sided PCBs

A reflow oven for four-sided printed circuit board (PCB) prototyping is an oven used in the reflow soldering process. It involves a series of important steps and the use of high-quality materials. For larger-scale production, wave soldering is often used. Wave soldering requires a specific PCB size and alignment. Individual soldering may also be achieved with a hot air pencil.

A reflow oven has several distinct heating zones. It may have one or more zones, which are programmed to correspond to the temperature of the circuit board when it passes through each zone. These zones are set up with an SMT program, which is usually a sequence of set points, temperature, and belt speed. These programs provide complete transparency and consistency throughout the reflow process.

 

PCB Solder Mask Types – The 4 Types of Solder Masks For PCBs

In order to choose the right solder mask for your project, you must be familiar with its specifications. These specifications specify the hardness, shelf life, and flammability of the product. In addition, they specify the resistance of the solder mask to oxidation, moisture, and biological growth. You may also want to choose a matte or satin finish solder mask, as these can minimize solder beading.

LPI solder mask

In the past, PCB manufacturers would offer two different LPI solder mask types – matte and gloss. Few customers would indicate which one they wanted, so the decision was often left up to the manufacturer. Today, however, customers can weigh the benefits of each type of finish. While there is little difference in performance between the two types of solder mask, a glossy finish may be more appealing to some.

The main difference between these two types of solder masks is their process of application. The first type is a dry film photo imageable solder mask, which is similar to a sticker, except that it is held together by solder. After the soldering process, the dry film photo imageable solder mask is peeled off from one side and the remainder of the material is applied to the PCB mask side-down. The second type is the liquid solder mask, which follows the same procedure without the sticker.

LPI solder masks can be silkscreened or spray-coated onto PCB. These solder masks are most often used in conjunction with Electro-less Nickel, Immersion Gold or Hot Air Solder Leveling surface finishes. For proper application, the PCB should be cleaned and free of contaminants and the solder mask needs to cure thoroughly.

Epoxy solder mask

There are two primary types of epoxy solder masks. One type is made of liquid epoxy that is silkscreened onto a PCB board. This method of solder mask printing is the least expensive and most popular. A woven mesh is used to support the ink-blocking pattern. The epoxy liquid hardens during thermal curing. A dye is then mixed into the epoxy, which cures to produce the desired color.

The thickness of the solder mask depends on where the traces are on the circuit board. The thickness will be thinner near the edges of the copper traces. The thickness should be at least 0.5 mils across these traces, and can be as thin as 0.3 mils. In addition, the solder mask can be sprayed on a PCB for uniform thickness.

Different types of solder mask are available in varying colors. While the most common color is green, other types are available in black, white, orange, and red. Depending on the application, you can choose a color that best complements your project.

Transparent solder mask

There are several types of transparent solder mask available for PCB manufacturing. These are used to protect copper traces from oxidation. These masks also prevent the formation of solder bridges between solder pads. While they don’t provide perfect transparency, they can still be effective for achieving your design goals.

However, the type of solder mask you choose depends on several factors, including the board’s dimensions, surface layout, components, and conductors. You also need to consider the final application. There may also be industry standards that you need to meet, especially if you’re working in a regulated industry. Generally speaking, liquid photo-imageable masks are the most common and reliable option for PCB manufacturing.

In addition to the more common colors, there are also some more unique solder mask types. For example, there are rarer, more colorful masks available, which can be useful for designers and niche electronics makers. The type of solder mask used will affect the performance of the PCB, so it’s important to choose the right type based on your project’s needs.

Graphite solder mask

Different solder mask colors have different viscosities, and the difference is important to know if you’re planning to use one for your PCB. Green solder masks have the lowest viscosity, while black ones have the highest. Green masks are more flexible, making them easier to apply to PCBs with high component densities.

These solder masks offer protection to PCBs and their surface finishes. In particular, they are useful for equipment that requires high performance and uninterrupted service. They are also suited for applications requiring extended presentation life. These solder masks are a time-saving alternative to manual masking with heat-resistant tapes.

Another type of solder mask is dry film photoimageable solder mask. This type of solder mask has an image that is created on the film, and it is then soldered onto the copper pads of the PCB. The process is similar to that of an LPI, but the dry film solder mask is applied in sheets. The process makes the undesired solder mask adhere to the PCB, and eliminates any air bubbles underneath. Afterwards, workers remove the film with solvent, and then thermally cure the remaining solder mask.

Altium Designer – A Basic Guideline From Schematic to PCB Design

In this Altium Designer tutorial, you’ll learn how to create a schematic and compile it into a PCB design. You’ll also learn about importing components into a blank PCB layout and identifying routing requirements. Then, you’ll know what to do next to get your PCB ready for fabrication.

Creating a schematic in Altium Designer

Creating a schematic in Altium Designer can be done by importing an existing schematic file or by creating a new schematic. If you’ve created a circuit board before, it’s not necessary to start from scratch. Altium Designer includes guidelines for design reuse. To begin, open the board’s schematic window.

Altium Designer has two environments: the primary document editing environment and workspace panels. Some panels dock on the left side of the tool, while others pop out or are hidden. To move around a schematic, click and hold the right mouse button or hold the left Ctrl key while clicking the screen. To zoom, use the options on the top menu.

You can then drag and drop components to the schematic. You can also use the explorer window to view and select components. Alternatively, click and drag on the schematic window to place them. You can also hold down the mouse button to set a component.

Compiling it to a pcb design

Once you have a schematic, you can use Altium designer to compile it to a PCB design. It has several features, including the ability to create a library of components. Then, you can set the footprints for your components, and choose from the various options for each. Depending on the size and density of your board, you can choose the normal (N) or medium (M) footprint.

After you’ve created your PCB layout, you’ll want to add the schematic to your project. This will automatically link your schematic and BOM. Altium Designer can even compile your schematic data automatically while you’re creating your design. To do this, click on the library tab in the left pane of the screen. On the next screen, you’ll want to check that the components you’ve added are properly integrated into the PCB layout.

Importing components into a blank PCB layout

Importing components into a blank PCBA layout in Altium Designer is a quick and easy process. After you import the components, you can turn on or off specific layers, and then arrange them in the PCB. After that, you can route traces between the components.

First, you need to create a schematic PCB layout. To do so, add a new schematic or add an existing schematic. Then, on the left screen, click on the library tab. You can then check to see if the component you selected is integrated.

After you import the components, Altium Designer will check for the compliance of the schematic with the design rules. This is an important step in the design process, because errors in the schematic may affect the quality of your finished PCB.

Routing requirements in Altium Designer

Altium Designer includes built-in tools for managing routing requirements. These tools are useful when adding new components to a schematic or PCB. However, there are still some rules to adhere to when auto-routing. The first tool to use for routing requirements is a net class. Once configured, a net class will automatically route the components in an appropriate way.

A rule-driven design engine is also included in Altium Designer to ensure that the PCB layout complies with all signaling standards. The rules-driven design engine also checks the layout against various design requirements to ensure that it follows the design rules. As a result, Altium Designer ensures the quality of your design. In addition, successful PCB routing starts with the right stackup, which supports your impedance goals and trace density requirements. This step allows you to set specific impedance profiles for important nets, so that the signal is not lost during routing.

Steps in the process

Once you have created a schematic, you can export it in the form of a netlist or bill of materials in Altium Designer. These files are required for the fabrication of the PCB. They contain all of the necessary information for manufacturing the board, including a list of all of the required materials. In addition, these documents can be reviewed after each step.

Altium Designer also has a tool for schematic capture, which allows you to import schematic components into a PCB layout. The software will then generate a PcbDoc file and a blank printed circuit board document.