How High Thermal Conductivity PCB Material Will Solve the Heat Dissipation Problem

Leiterplatten, auch Printed Circuit Boards genannt, sind Schichtstrukturen aus Kupferfolien, die zwischen Glas-Epoxid-Schichten eingebettet sind. Diese Schichten dienen als mechanischer und elektrischer Träger für die Komponenten. Die hochleitfähigen Kupferfolien dienen als leitende Schaltung in der Leiterplatte, während die Glas-Epoxid-Schicht als nichtleitendes Substrat dient.

High thermal conductivity pcb material

Thermal conductivity is the ability of a material to transfer heat away from a device. The lower the thermal conductivity, the less efficient the device is. High thermal conductivity materials can eliminate the need for vias and produce a more uniform temperature distribution. This also reduces the risk of localized volumetric expansion, which can lead to hotspots near high-current components.

A typical PCB for a personal computer might consist of two copper planes and two outer trace layers. Its thickness is about 70 um and its thermal conductivity is 17.4 W/mK. The result is that the typical PCB is not an efficient heat conductor.

Copper coins

Copper coins are small pieces of copper embedded into the PCB. They are placed under the component that produces the most heat. Their high thermal conductivity allows them to transfer heat away from the hot component to a heat sink. They can be made in different shapes and sizes to fit the desired areas and can be metalized to ensure a tight connection.

Glass-epoxy

The problem of heat dissipation is becoming more important in electronics. Excess heat can lead to underperformance and early failure. Currently, heat dissipation options are limited, particularly in the extreme environments. One of the solutions to this problem is the use of high-temperature glass epoxy PCB material, or HDI-PCB. This material is able to solve this problem by having a thermal conductivity over two hundred times better than FR4 composite.

The glass epoxy resin has excellent heat and flame resistance. It has a high glass transition temperature and high thermal conductivity. It can serve as an insulating layer and a heat dissipation layer. It can be made by impregnation or coating. The thermal conductivity of glass epoxy PCB will improve the performance and stability of electronic components.

Metal core PCBs

Metal core PCB manufacturers have introduced new board substrates that can withstand high temperatures. This allows them to selectively apply thicker copper layers that have higher thermal conductivity. This type of PCB enables better heat dissipation and can be used for fine circuit patterns and high-density chip packaging.

In addition to offering higher thermal conductivity, metal PCBs are also dimensionally stable. Aluminum metal core PCBs have a 2.5-3% size change when heated, making them ideal for high-power applications. Their low thermal expansion properties also make them suitable for high switching power. The most commonly used metal used for a metal core PCB is aluminum, which is cheap and recyclable. Its high thermal conductivity allows for a fast cooling process.

Another problem associated with heat dissipation is the risk of excessive heat. The heat generated by heat-generating components must be removed from the board, otherwise the PCB will not perform at its best. Fortunately, there are now new options to solve this problem. High thermal conductivity metal core PCBs are a new kind of thermal solution that can overcome these problems.

FR4 substrates

PCBs are layered structures made of copper foils and glass-reinforced polymers. They support and connect electronic components. The copper creates a conductive circuit within the PCB, while the glass-epoxy layer acts as a nonconductive substrate.

High-power components are best placed near the center of the PCB, rather than on the edges. This is because heat accumulates near the edges and scatters out. Also, heat from high-power components should be placed far away from sensitive devices, and the heat must be channeled away through the PCB.

High thermal conductivity PCB material is the best solution for heat dissipation, allowing for rapid transfer of heat and preventing heat accumulation. High-tech PCBs use copper base, aluminum, or ceramic as the substrate material. This will solve the heat dissipation issues and make the PCBs more durable.