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A BGA-összetevők forraszgolyó problémái és azok orvoslása

Solder Ball Issues of BGA Components and Their Remedies Solder ball issues of BGA components are common problems that can lead to deterioration of the components. These problems are caused by solder ball delamination or oxidation. Fortunately, the remedies are simple and do not require any complex technical knowledge. These solutions will help you prevent […]

A PCB hibák felderítésének módszerei

Methods For Detecting PCB Failures There are several ways to detect PCB failures. Among these methods are X-rays, Slice analysis, and Optical microscopy. Each of these methods is useful for identifying and assessing the extent of PCB damage. However, not all of these methods are suitable for every PCB failure. For example, electrostatic discharge damage […]

Exkluzív elrendezési tippek BGA chipekhez

Exclusive Layout Tips For BGA Chips To layout a BGA chip, you should understand its footprint. There are several different types of layouts. You can choose from Vias, Fanouts, and Fiducial marks. The datasheet for the NCP161 chip provides the recommended pad size and shape. Fanouts If you’re designing a PCB with BGA chips, it […]