Masalah Bola Solder pada Komponen BGA dan Solusinya
Solder Ball Issues of BGA Components and Their Remedies Solder ball issues of BGA components are common problems that can lead to deterioration of the components. These problems are caused by solder ball delamination or oxidation. Fortunately, the remedies are simple and do not require any complex technical knowledge. These solutions will help you prevent […]