SMTP処理中にBGAパッド下のPCB樹脂材料が割れる理由
Reasons For PCB Resin Material Cracking Under BGA Pads During SMTP Processing Cracking of PCB resin material occurs due to the presence of entrapped moisture. The reason for this is a high soldering temperature that results in an increase in vapor pressure. The cracks can also occur because the board’s thermal expansion causes the spacing between the BGA pads to change. To mitigate the risk of this type of fault, alternative pad finishes can be used, which reduces the thermal impact on adjacent packages. Entrapped moisture causes pcb resin material cracks Entrapped moisture can cause a wide range of PCB failures, including delamination, blistering, and metal migration. It can also […]