ディップはんだ付けとSMDソレッドデバイス
Dip Soldering and SMD Solered Devices Dip soldering and smd soldered devices are two different processing methods that are used to assemble electronic devices. Both methods use a reflow process that involves a gradual heating of the solder paste. When the reflow process is successful, the melted solder paste effectively bonds the mounted components to the PCB, creating a stable electrical connection. The two methods share several common characteristics. Asymmetrical wave soldering Asymmetrical wave soldering is the process of forming a ring of solder that surrounds the part and is able to separate it from the surrounding air. It also creates a barrier between the solder and oxygen. This method […]