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ディップはんだ付けとSMDソレッドデバイス

Dip Soldering and SMD Solered Devices Dip soldering and smd soldered devices are two different processing methods that are used to assemble electronic devices. Both methods use a reflow process that involves a gradual heating of the solder paste. When the reflow process is successful, the melted solder paste effectively bonds the mounted components to the PCB, creating a stable electrical connection. The two methods share several common characteristics. Asymmetrical wave soldering Asymmetrical wave soldering is the process of forming a ring of solder that surrounds the part and is able to separate it from the surrounding air. It also creates a barrier between the solder and oxygen. This method […]

PCBチップパッケージのはんだ付け方法とプロセス

Soldering Methods of PCB Chip Package and Processes Soldering is a critical part of a PCB chip package. Soldering processes involve a combination of techniques, including focused IR, convection, and non-focused IR. Each method involves a gradual heating of the package, followed by cooling the entire assembly. Soldering process Soldering is the process of joining solder balls and other solder materials to PCB chip packages. This process is done using two types of methods. The convection method and the reflow process. The first type involves a heating process using a flux that forms a liquid. In both processes, the peak temperature is controlled. However, the reflow process must be performed […]

はじめに 片面および両面SMTアセンブリについて

Introduction About Single-Sided and Double-Sided SMT Assembly Single-sided and double-sided SMT assemblies differ in terms of component density. Single-sided SMT assembly has a higher density than double-sided SMT assembly and requires a higher amount of heat to process. Most assemblers process the higher-density side first. This minimizes the risk of components falling out during the heating process. Both sides of the reflow assembly process require the addition of SMT adhesive to hold the components in place during the heating operation. FR4 PCB Single-sided PCBs are the most common. In a single-sided board, all the components are located on one side of the board, and assembly is only needed on that […]

PCBインピーダンス計算モデルの作成方法

How to Do a PCB Impedance Calculation Model Using a Smith chart The Smith chart is a useful tool when you want to determine the impedance of a circuit. It is a visual representation of the complex resistance versus frequency of an electrical circuit. It also shows the locus of impedance versus frequency, which is necessary for stability analysis and oscillation avoidance. Many PCs have the ability to display impedance values numerically, but the Smith chart helps you visualize the possibilities. The Smith chart can be used to evaluate the signal path between a PC board’s contact pads and an electronic device. This device may be an IC, a transistor, […]

RFおよびマイクロ波設計におけるロジャーPCB材料の選択と使用方法

How to Choose and Use Roger PCB Material in RF and Microwave Designs When choosing a PCB material for your next RF or microwave design, there are a few important considerations you should make. These include the bearing temperature, the maximum and minimum operating temperatures, and the reversibility of the material. For example, if your project requires a high bearing temperature, you’ll probably want to use Rogers PCB. RF If your circuit board design requires a high-frequency and low-dielectric constant material, you might be wondering how to choose and use Roger PCB material. Fortunately, you have several options. Teflon-based cores are available from many companies. These materials can be very […]

両面SMD基板はどのように組み立てられるか?全工程と比較

How Are Double Sided SMD Boards Assembled? Full Process and Comparison This article will compare the cost and assembly process of double-sided vs single-sided SMD boards. It will also cover the benefits and disadvantages of both types of boards. In addition, it will help you understand the differences between soldering and Solder paste printing. Single-sided vs double-sided smd boards Single-sided and double-sided SMD boards are different in many ways. Double-sided boards have more space and are capable of carrying more components and connections. They are a great choice for complicated electronics. Double-sided PCBs are generally more expensive and complex to assemble. Nevertheless, they have a few benefits. Single-sided PCBs have […]

さまざまなPCBはんだ付けプロセス

Different Types of PCB Soldering Processes When it comes to PCB soldering, you have a few options. There is reflow, surface mount technology, and wave soldering. Learn more about them. Each one has its benefits and drawbacks. Which one is best for your PCB? Wave soldering Wave soldering processes are used to solder electronic components on printed circuit boards. The process passes the PCB through a pot of molten solder, generating standing waves of solder that are used to form joints that are electrically and mechanically reliable. This process is most commonly used for through-hole component assembly, but it can also be used for surface-mounting. Initially, wave soldering was used […]

PCBの種類と機能

PCB Types and Functions PCB in medical industry The medical sector relies heavily on PCBs for a variety of products, including blood pressure monitors, infusion pumps, and heart rate monitors. These devices deliver accurate amounts of fluid to patients through tiny electronic components. As technology improves, the medical industry will continue to find new uses for PCBs. Printed circuit boards Printed circuit boards are a vital part of many industries. They are used in a variety of products, from massive machinery to consumer devices. Here are some common uses for these boards. In industrial applications, they are required to withstand high power and extreme temperatures. They may also be exposed […]

高周波設計におけるアースの扱い方

How to Deal With Grounding in High Frequency Design High frequency designs need to address the issue of grounding. There are several issues that need to be addressed when it comes to grounding. These include the impedance of grounding conductors and grounding bonds, DC path dominating low-frequency signals, and single-point grounding. Impedance of grounding conductors The grounding electrode of a typical grounded electrical system is in parallel with the ground rods located on the line side of the service, transformers, and poles. The rod under test is connected to the grounding electrode. The equivalent resistance of the line side ground rods is negligible. A single-point grounding method is acceptable for […]

無電解錫めっきPCBパッドにおけるはんだ付け不良の故障解析

Failure Analysis of Soldering Defects on Immersion Tin PCB Pads Soldering defects are a common cause of PCB failure. There are several different types of defects that can lead to PCB failure. The article below explores three types of defects: Wetting, Plating through hole barrel cracking, and Liquid fluxes. Wetting defects Exposure to environmental factors during the manufacturing process can affect the wetting ability of immersion tin pcb pads. This can reduce assembly yield and second level reliability. Therefore, it is important to avoid or correct poor wetting defects. This research explored the effects of different temperature conditions on the wetting ability of these pads. Immersion tin pads exhibit a […]