SMTP 공정 중 BGA 패드 아래에서 PCB 수지 재료가 갈라지는 이유
Reasons For PCB Resin Material Cracking Under BGA Pads During SMTP Processing Cracking of PCB resin material occurs due to the presence of entrapped moisture. The reason for this is a high soldering temperature that results in an increase in vapor pressure. The cracks can also occur because the board’s thermal expansion causes the spacing […]