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BGA komponentų lydmetalio problemos ir jų sprendimo būdai

Solder Ball Issues of BGA Components and Their Remedies Solder ball issues of BGA components are common problems that can lead to deterioration of the components. These problems are caused by solder ball delamination or oxidation. Fortunately, the remedies are simple and do not require any complex technical knowledge. These solutions will help you prevent […]

PCB gedimų nustatymo metodai

Methods For Detecting PCB Failures There are several ways to detect PCB failures. Among these methods are X-rays, Slice analysis, and Optical microscopy. Each of these methods is useful for identifying and assessing the extent of PCB damage. However, not all of these methods are suitable for every PCB failure. For example, electrostatic discharge damage […]

Išskirtiniai BGA lustų išdėstymo patarimai

Exclusive Layout Tips For BGA Chips To layout a BGA chip, you should understand its footprint. There are several different types of layouts. You can choose from Vias, Fanouts, and Fiducial marks. The datasheet for the NCP161 chip provides the recommended pad size and shape. Fanouts If you’re designing a PCB with BGA chips, it […]

Kuo skiriasi "Hasl Lead Free" ir "Hasl Lead Free"?

What’s the Difference Between Hasl Lead Free and Hasl Lead Free? HASL is a tin-lead alloy. It forms joints easily and is often used in hand-soldering. Its strong joints are made possible by the close molecular bonding of the two metals. This makes it a preferred finish for high-reliability applications. HASL is a tin-lead alloy […]