Exklusive Layout-Tipps für BGA-Chips

To layout a BGA chip, you should understand its footprint. There are several different types of layouts. You can choose from Vias, Fanouts, and Fiducial marks. The datasheet for the NCP161 chip provides the recommended pad size and shape.

Fanouts

If you’re designing a PCB with BGA chips, it is important to consider the best routing pattern for your part. A high pin-count BGA chip, for example, requires meticulous planning to achieve the right escape routing patterns. You’ll need to take into account factors such as the component’s pitch and the desired spacing between its balls.

The best route for a BGA chip consists of two basic steps. First, you should calculate the number of layers needed to route the signal pins. There are two basic routes you can use for your BGA: a traditional fanout, or a dog-bone fanout. Typically, the dog-bone fanout method is used for larger-pitch BGAs. It allows you to route the outer two rows of pins on the surface layer, while leaving the remaining inner pads free of vias.

Fiducial marks

BGA chips are widely used in electronic assembly. However, because of their peculiar shape, they present a higher risk of short circuits during soldering. The right layout tips and practices can help you avoid these problems. In this article, you will learn how to correctly place BGA chips on your PCB in order to maximize the soldering effect.

The first step in proper BGA chip layout is to ensure the proper spacing of the components. Usually, the pads are not numbered sequentially but rather in a column-row format. The columns are numbered from left to right, starting with A1. Pin A1 is typically indicated by a mark on the top side of the chip.

Corner marks

When it comes to PCB layout, the same rules apply whether you’re working with BGA chips or other types of electronic components. The best way to achieve optimum performance is to make sure that your BGAs are mounted with a powerful X-ray system. You should also use a vision placement system to ensure that your BGAs are positioned correctly.

When working with high-pin-count BGA chips, planning is key. You may need to add several board layers to accommodate all the escape routing. You must also carefully consider the placement of components before you begin routing the traces.

Power integrity

High-pin-count BGA chips require careful planning before routing traces. You should also take into account the routing channels required for vias that exit the pins. In some cases, it may be necessary to add two additional board layers to accommodate the extra pins. Moreover, BGAs have multiple rows and columns, which requires careful placement of components.

The first step is to decide where to place the BGAs. Some designers use flip-chip BGAs, in which some pins are removed from the interior rows. Others use microvias, which are drilled by laser. Blind vias are also an option, but they are more expensive. Blind vias are usually included in the most expensive layout plans.