Was ist Oberflächenmontage-Löten?

Surface mount soldering is the process of soldering electronic components by applying flux to the surface of the components. Typical soldering components include resistors, capacitors, diodes, and inductors, which all have two terminals. ICs, on the other hand, have more than two legs, and have one pad per leg. When soldering ICs, the legs should be lightly tinned, preferably the corner pad.

Surface mount soldering

When soldering surface-mounted components, you must be careful to align the components properly. For instance, the leads on a TQFP microcontroller are very small and require precise placement. If you want to ensure that the soldering will work properly, you should first cut the excess leads.

Surface-mount soldering requires special skills and equipment. Unlike conventional soldering, it requires close monitoring of the amount of heat used. It’s not recommended for large components and high-voltage components. For these reasons, some PCBs that use large components require a combination of surface mount and through-hole soldering techniques. Moreover, surface-mount soldering creates weaker connections than through-hole soldering, which is not always suitable for components that experience sheer force.

Despite the fact that surface mount soldering can lead to less expensive PCBs, there are many issues involved with this process. For example, a bad connection can ruin the entire board. To avoid these problems, it’s best to avoid rushing when soldering. A good soldering technique will be developed over time.

Flux

The type of flux that is used in surface mount soldering is very important, as it will greatly affect the final result. Flux helps in removing oxides from connections and helps in heat distribution. It is contained in a flux-cored solder wire that flows out when it comes into contact with the hot connection. This prevents further oxidation of the metal. The flux is applied in one of three ways: by brush, needle, or felt pen.

The flux can fail to meet soldering requirements if it is not properly cleaned before the soldering process. Impurities in the flux can prevent the solder from adhering to the components, which may result in a non-wetting solder joint. During the soldering process, the solder paste should be reheated between 300degF and 350degF. Afterward, the temperature should be adjusted to around 425degF and the solder will be melted.

Reflow-Löten

Reflow soldering is a surface mount soldering process in which the solder paste flows to the pads of the printed circuit board without overheating. This process is very reliable and is ideal for soldering surface mount components with excellent pitch leads. The PCB and electrics must be properly secured before the solder paste is melted.

The reflow soldering process has four basic stages. These stages are preheat, thermal soak, reflow, and cooling. These steps are crucial for forming a good solder joint. In addition, the heat must be applied in a controlled manner to avoid damage to the components and PCB. If the temperature is too high, components may crack, and solder balls may form.

Reflow soldering equipment

Surface mount soldering is the process of joining two items by heating them together. It is different from welding because it involves closely monitoring the amount of heat being used. Unlike welding, surface mount soldering is done on the surface of a board rather than through holes. This makes it much cheaper to manufacture and more accessible for manufacturing companies.

The process of reflow soldering is a time-consuming process that requires quality components and PCB. It also requires a profile to make sure the soldering process is consistent and repeatable. However, it is worth the extra effort if it means producing high quality circuit boards.

Temperature recommendations for surface mount soldering

To avoid overheating or damageing the components, it is essential to maintain an optimal soldering temperature range. For surface mount applications, this range is between 210 and 260 degrees Celsius. For lead-free components, a higher temperature is recommended. For more information, refer to the J-STD-020C standard.

The soldering temperature range is defined by the soldering profile, which takes into account the composition of components and paste as well as components that have high thermal masses. Before starting the process, prepare the board by applying solder paste. Once this is done, attach the correct contacts to the board. Then, insert it into a vapour phase soldering machine. The heating system then begins the soldering process and follows a pre-set temperature course.

To solder lead-free wire, the soldering iron should be set to at least 600 deg F. Once set to the proper temperature, hold the tip against the lead to allow the solder to flow around the lead. When the solder joint has formed, it should look like a slight pyramid. Trim the lead, if necessary, but remember that removing excess lead may damage the solder joint.