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Problemas con las bolas de soldadura de los componentes BGA y sus soluciones

Solder Ball Issues of BGA Components and Their Remedies Solder ball issues of BGA components are common problems that can lead to deterioration of the components. These problems are caused by solder ball delamination or oxidation. Fortunately, the remedies are simple and do not require any complex technical knowledge. These solutions will help you prevent […]

Métodos para detectar fallos en las placas de circuito impreso

Methods For Detecting PCB Failures There are several ways to detect PCB failures. Among these methods are X-rays, Slice analysis, and Optical microscopy. Each of these methods is useful for identifying and assessing the extent of PCB damage. However, not all of these methods are suitable for every PCB failure. For example, electrostatic discharge damage […]

Consejos exclusivos para el diseño de chips BGA

Exclusive Layout Tips For BGA Chips To layout a BGA chip, you should understand its footprint. There are several different types of layouts. You can choose from Vias, Fanouts, and Fiducial marks. The datasheet for the NCP161 chip provides the recommended pad size and shape. Fanouts If you’re designing a PCB with BGA chips, it […]

Factores que afectan al coste del montaje de PCB

Factors That Affect PCB Assembly Cost If you’re in the market for PCB assembly services, there are some factors that affect the price. These include custom specifications, the number of layers and lead time, as well as the quality of labor. Understanding these factors will help you negotiate with a PCBA assembly service. If you’re […]