Las capas conductoras suelen estar hechas de una fina lámina de cobre. Las capas aislantes dieléctricas suelen estar laminadas con resina epoxi preimpregnada. La placa suele recubrirse con una máscara de soldadura de color verde. Otros colores normalmente disponibles son el azul, el negro, el blanco y el rojo.

There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability.

FR-4 is by far the most common material used today,The board with copper on it is called “copper-clad laminate”.

Copper foil thickness can be specified in ounces per square foot or micrometers. One ounce per square foot is 1.344 mils or 35 micrometers.

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