Les circuits imprimés flexibles (PCB) sont parfaits pour les besoins électroniques actuels. Ils sont légers, peuvent être compacts et, avec une conception appropriée, peuvent offrir des solutions extrêmement robustes. Cependant, bien que les circuits imprimés flexibles puissent se plier, ils doivent répondre à certaines exigences spécifiques que les circuits imprimés rigides traditionnels n'ont pas.

The design process of flexible PCBs must consider the number of layers, placement of features, circuit architecture, and materials. The designer must also consider the frequency of circuit flexure, and the method of formation of the bend, including the bend tightness and the degree of the bend. The designer can take advantage of the full potential of the technology by working within the requirements of flexible PCBs. These include recognizing the unique demands made upon the flex PCBs, while carefully defining the application and design priorities.

Critical Design Factors

The distance of the neutral bend axis from the center of the PCB’s material stack is a critical design factor. This distance must remain small to distribute the forces evenly among all layers of the PCB when it flexes.

The risk of damage increases if the PCB is thick and has to flex more—a low bend angle reduces the risk, while thin PCBs face a lower risk of damage when flexed. The risk of damage reduces if the bend radius is large.

A proper selection of material is very important for accommodating flex and the way these forces travel to other layers in the bend area. The risk of damage reduces with the use of materials allowing greater flexibility.

Presence of stiffeners within or near the bend area increases the risk of PCB failure. Designers should avoid placing stiffeners and similar features in or near the bend area, as these make the PCB vulnerable to forces generated in the bend area. Additionally, they can weaken the surrounding circuit structure when the PCB flexes.

Placing discontinuities in the bend area enhances the risk of damage when the PCB has a high frequency of flexing. Forming techniques and conductor routing are other factors affecting the risk of damage during PCB flexing.

Environmental Factors

Among the environmental factors affecting flexible PCBs are the presence of humidity, dust, gas or liquid chemicals, static electricity, and temperature.

Moisture condensing or presence of water on a PCB can electrically short two neighboring tracks, rendering the entire gadget non-functional. Similarly, PCBs operating in damp conditions may lead to mold formation, and subsequent circuit failure.