PCB 기판 설계의 몇 가지 중요한 단계를 이해하는 방법

If you are interested in designing a PCB board, there are a number of important steps that you must know. These steps include Ideation, Definition, Validation, and Placement of components. Understanding these steps will help you make the best design possible.

Ideation

Creating an effective PCB board design starts with defining the purpose of the device. It is essential to match the board’s dimensions and height constraints with the intended components. Other considerations include the components’ ESR at high frequencies and temperature stability. In addition, it is necessary to choose the proper trace width and spacing. Failure to adhere to this general rule can lead to an explosion of costs.

The PCB design process begins with ideation, definition, and validation. This step is critical and occurs before designing a prototype or executing a design. It highlights the designer’s creativity and makes sure that all hardware components are aligned and congruent. It also enables cross-collaboration among the various team members, resulting in synergy.

Definition

The design of a PCB is a complex process. It includes choosing the right materials for the PCB base, selecting a design rule, and selecting the final dimensions. The PCB must also be tested to ensure that it will function properly under the intended operating conditions. If the design is not done correctly, the project could end in failure.

The first step in PCB design is to create a set of blueprints. This is done through computer software. The blueprints serve as a model for the design. The designer can also use a trace width calculator to determine the inner and outer layers. The conductive copper traces and circuits are marked in black ink. The traces are known as layers in the PCB design. There are two types of layers, the outer and the inner.

Validation

PCB boards go through validation processes to ensure they are designed correctly. These tests are performed by examining the board’s structures. These structures include probes and connectors, as well as the Beatty standard for material parameters. These tests are performed in order to eliminate any design errors, such as reflections.

The PCB boards are then prepared for manufacturing. The process depends on the CAD tool used and the manufacturing facility. It usually involves the generation of Gerber files, which are drawings of each layer. There are several Gerber viewer and verification tools available, some of which are built into CAD tools, while others are standalone applications. One example is ViewMate, which is free to download and use.

The validation process also involves testing the device. The design is tested with a prototype to ensure it meets the expected response. In addition, it includes an analysis of the circuit to determine if the design is stable. The results of this test determine if any changes are required. Some modifications should be made in order to improve the design and ensure that it meets the specifications of the customer.

Placement of components

Placement of components on PCB boards can be done in many ways. You can place them above or below another component, or you can use a combination of these methods. Placements can be made tidy by aligning components by choosing Align Top or Align Bottom. You can also evenly distribute components on the board by selecting components and right-clicking on them. You can also move components to the top or bottom side of the PCB by pressing L.

When designing PCBs, placement of components is crucial. Ideally, components are placed on the top side of the board. However, if the component has a low thermal dissipation, then it can be placed on the bottom side. It is also recommended to group similar components together and place them in an even row. Moreover, you should also place decoupling capacitors in close proximity to active components. In addition, you should place connectors according to the design requirements.

Dielectric breakdown voltage

Whether you’re designing your own PCB or sourcing a PCB from a manufacturer, there are several steps that you should know about. Some of these steps include: testing the PCB’s electrical components and layout for functionality. This is done by running it through a battery of tests in accordance with IPC-9252 standards. Two of the most common tests are isolation and circuit continuity tests. These tests check whether there are any disconnections or shorts in the board.

After the design process is complete, it’s important to consider the thermal expansion and thermal resistance of the components. These two areas are important because the thermal expansion of the board components increases when it gets hotter. The Tg of a board’s components must be high enough to prevent the components from being damaged or deformed. If Tg is too low, it can cause the components to fail prematurely.

PCB 레이어 스택업을 사용하여 전자파 방사를 제어하는 방법

PCB 적층 스택업은 EMC를 줄이고 EMF 방출을 제어하는 가장 좋은 방법 중 하나입니다. 하지만 위험이 없는 것은 아닙니다. 두 개의 신호 레이어로 PCB를 설계하면 신호 라우팅을 위한 보드 공간이 부족하여 PWR 평면이 절단될 수 있습니다. 따라서 두 개의 적층된 전도성 평면 사이에 신호 레이어를 배치하는 것이 좋습니다.

Using a 6-layer PCB stackup

A 6-layer PCB stackup is effective for decoupling high-speed signals and low-speed signals, and can also be used to improve power integrity. By placing a signal layer between the surface and the interior conductive layers, it can effectively suppress EMI.

The placement of the power supply and ground on the 2nd and fifth layers of the PCB stackup is a critical factor in controlling EMI radiation. This placement is advantageous because the power supply’s copper resistance is high, which can affect the control of common-mode EMI.

There are different configurations of 6-layer PCB stackups that are useful for different applications. A 6-layer PCB stackup should be designed for the appropriate application specifications. Then, it must be thoroughly tested to ensure its functionality. After this, the design will be turned into a blue print, which will guide the manufacturing process.

PCBs used to be single-layer boards with no vias and clock speeds in the hundred kHz range. These days, they can contain up to 50 layers, with components nestled between layers and on both sides. Signal speeds have increased to over 28 Gb/S. The benefits of solid-layer stackup are numerous. They can reduce radiation, improve crosstalk, and minimize impedance issues.

Using a core-laminated board

Using a core-laminated PCB is an excellent way to protect electronics from EMI radiation. This type of radiation is caused by fast-changing currents. These currents form loops and radiate noise when they change rapidly. In order to control the radiation, you should use a core-laminated board that has a low dielectric constant.

EMI is caused by a variety of sources. The most common is broadband EMI, which occurs over radio frequencies. It is produced by a number of sources, including circuits, power lines, and lamps. It can damage industrial equipment and reduce productivity.

A core-laminated board can include EMI reducing circuits. Each EMI reducing circuit comprises a resistor and a capacitor. It can also include a switching device. The control circuit unit controls each EMI reducing circuit by sending selection and control signals to the EMI-reducing circuits.

Impedance mismatching

PCB layered stackups are a great way to improve EMI control. They can help contain electrical and magnetic fields while minimizing common-mode EMI. The best stackup has solid power and ground planes on outer layers. Connecting components to these planes is faster and easier than routing power trees. But the trade-off is increased complexity and manufacturing costs. Multilayer PCBs are expensive, but the benefits may outweigh the trade-off. To get the best results, work with an experienced PCB supplier.

Designing a PCB layered stackup is an integral part of the signal integrity process. This process requires careful consideration of mechanical and electrical performance requirements. A PCB designer works closely with the fabricator to create the best possible PCB. Ultimately, the PCB layer stackup should be able to route all signals successfully, keep signal integrity rules intact, and provide adequate power and ground layers.

A PCB layered stack-up can help reduce EMI radiation and improve signal quality. It can also provide a decoupling power bus. While there is no one solution to all EMI issues, there are several good options for optimizing PCB layered stacks.

Trace separation

One of the best ways to control EMI radiation is to use layer stack up in PCB designs. This technique involves placing the ground plane and signal layers next to each other. This allows them to act as shields to the inner signal layers, which helps reduce common-mode radiation. Moreover, a layered stackup is much more efficient than a single-plane PCB when it comes to thermal management.

In addition to being effective in containing EMI radiation, a PCB layered stack design also helps improve component density. This is done by ensuring that the space around the components is larger. This can also reduce common-mode EMI.

To reduce EMI radiation, a PCB design should have four or more layers. A four-layer board will produce 15 dB less radiation than a two-layer board. It is important to place the signal layer close to the power plane. The use of good software for PCB design can aid in choosing the right materials and performing impedance calculations.