Voordelen en nadelen van PCB oppervlakteafwerkingen

Voordelen en nadelen van PCB oppervlakteafwerkingen

Surface finishes can be classified in many different ways. This article discusses the main attributes of PCB surface finishes and the requirements of various types of PCB products. The benefits and disadvantages of each type are discussed. To determine the right surface finish for your PCB project, you can refer to the following table.

ENTEC 106(r)

Among the most widely used surface finishes in the PCB industry is ENEPIG. It is a two-layer metallic coating consisting of 2-8 min Au over 120-240 min Ni. The nickel acts as a barrier for the copper on the PCB surface. Gold protects the nickel from corrosion during storage and provides a low contact resistance. ENIG is often a cost-effective choice for PCBs, but it is important to use proper application procedures.

The advantages and disadvantages of electroplated gold over electrolytic nickel (ESN) are primarily cost-effectiveness and ease of plating. Electroplated gold over electrolytic nickel is very durable and has a long shelf life. However, electroplated gold over nickel has a higher price tag than other finishes. In addition, electroplated gold over nickel interferes with etching and must be handled with care to avoid damage.

ENEPIG

PCB surface finishes come in two major classifications: ENEPIG and ENIG. This article explores the differences between the two finishes and provides a comparison of their benefits and drawbacks. It also discusses when to use each.

The ENIG surface finish is a three-layer, bonded metallic finish. In the past, this material was mainly used on PCB boards with functional surface connections and high shelf-life requirements. However, the high cost of palladium and the requirement for a separate manufacturing line led to the failure of the material. In recent years, however, the material has made a comeback. Its high-frequency properties make it an excellent choice for high-frequency applications.

In comparison to ENIG, ENEPIG uses an additional layer of palladium between the gold and the nickel layers. This protects the nickel layer from oxidation and helps prevent the black pad problem. Because palladium prices have dropped recently, ENEPIG is now widely available. It offers the same benefits as ENIG but is more compatible with wire bonding. However, the process is more complex, requires additional labor, and can be expensive.

HASL

The HASL classification of PCB surface finish provides excellent solderability and is able to accommodate multiple thermal cycles. This surface finish was previously the industry standard, but the introduction of RoHS standards has forced it out of compliance. The alternative to HASL is lead-free HASL, which is more environmentally-friendly, safer, and better aligned with the directive.

Surface finish on PCBs is critical for reliability and compatibility. An appropriate surface finish can prevent the copper layer from oxidizing, which decreases the solderability of the PCB. However, the quality of the surface finish is only one part of the picture. Other aspects must be considered, such as the cost of board fabrication.

Hard goud

There are many classifications of PCB surface finishes, including the hard gold and soft gold finishes. Hard gold is a gold alloy that includes nickel and cobalt complexes. This type is used for edge connectors and PCB contacts and typically has a higher purity than soft gold. Soft gold, on the other hand, is typically used for wire bonding applications. It is also suitable for lead-free soldering.

Hard gold is generally used for components that have a high wear resistance. This is the type of plating that is used for RAM chips. Hard gold is also used on connectors, but the gold fingers must be 150 mm apart. Also, it is not recommended to place plated holes too close to gold fingers.

Immersion tin

PCB surface finishes are a critical process between PCB board manufacturing and circuit card assembly. They play an important role in maintaining the exposed copper circuitry and providing a smooth surface for soldering. Usually, the PCB surface finish is located at the outermost layer of the PCB, above the copper. This layer acts as a “coat” for the copper, which will ensure proper solderability. There are two types of PCB surface finishes: metallic and organic.

Immersion tin is a metallic finish that covers the copper on the PCB. It has the advantage of being able to be reworked easily in case of soldering errors. However, it has some disadvantages. For one, it can tarnish easily, and it has a short shelf life. As a result, it’s recommended that you use immersion tin PCB surface finishes only if you’re confident that your soldering processes are accurate.

Why Flexible PCB Need Stiffeners

Why Flexible PCB Need Stiffeners

A PCB stiffener is required to give your PCB its rigidity. There are several materials available to stiffen PCBs. Some are more expensive than others, such as FR4 or stainless steel. You need to decide which type is best for your specific needs.

Stainless steel

Flexible printed circuit boards (PCBs) are among the most popular types of PCBs on the market today. Their flexibility allows designers to design circuitry that isn’t possible with rigid circuits. However, a flexible PCB’s lack of stiffness can lead to performance and durability issues. For this reason, flexible PCBs often include stainless steel stiffeners.

A stiffener may be either thick or mass-oriented and attached to a flexible PCB on the same side as the components. If the flexible PCB is assembled with plated through-hole connections, the stiffeners may be attached to the opposite side of the connector. The stiffeners are then sealed into place with pressure-sensitive adhesives or thermal bonding.

The use of stiffeners for flexible PCBs is most commonly used for flex circuits. They help maintain a proper thickness of the flex circuit and prevent stress on the components and solder joints. This type of stiffener can be attached with thermally bonded acrylic adhesives or PSA.

Aluminum

Stiffeners are often required for flexible PCBs. They reduce the flexibility of the board and provide mechanical support for components during assembly. They also serve a role in heat dissipation. There are several types of stiffeners, and each one provides different benefits. For example, stiffeners can improve solder resistance, increase bond strength, and limit the bending ability of the board.

Generally, rigideners are attached to a PCB using pressure sensitive adhesive tape. PSA is a popular adhesive material for this purpose, which is designed to withstand high-temperature reflow cycles. The type of adhesive used depends on the length and location of the stiffeners. If the stiffeners extend beyond the flex circuit side, it is important to use PSA to attach them to the board. Additionally, PSA may not be suitable for stiffeners that are too short or too long.

Aluminum is an alternative material for stiffeners. This material has better heat-sink and rigidity than other materials. Aluminum is more expensive, but can be more durable than other materials.

Kapton

When working with flexible PCBs, it is necessary to consider stiffeners in your design. Adding a stiffener can increase solder resistance and strengthen the connections between components. It can also help with strain relief and heat dissipation. In most cases, stiffeners are bonded on the same side of the flexible PCB as the components.

FR4 and polyimide are two materials that are commonly used for stiffeners. These materials are cheap and can provide a flat surface to the flexible PCB. They also provide excellent solder resistance and can provide the required support during pick-and-place processes.

The placement of stiffeners is important because they must be installed on the same side as the components to be mounted. This also allows easy access to the solder pads. While stiffeners are important, some customers may choose to skip the stiffeners altogether and use a FR-4 frame instead of an SMT carrier.

FR4

FR4 stiffeners for flexible PCBs are an excellent way to maintain and route flexible PCBs. They work by extending a strip of FR-4 stiffener material into a flexible PCB array. This helps the flex PCB maintain its proper shape and avoid cracks in the conductor layers. In addition to providing support during assembly, these devices can also act as heat dissipation devices.

FR4 stiffeners can be made of a variety of materials, including stainless steel and aluminum. Stainless steel stiffeners are more resistant to corrosion, are more adaptable and more resistant to a wide range of temperature conditions. Stainless steel stiffeners are usually thin, ranging from 0.1 to 0.45mm.

FR4 stiffeners are added to a flexible circuit as the final fabrication step. They can be applied with either pressure sensitive or thermal-set adhesive. The choice may depend on the end-use, but pressure-sensitive stiffeners are usually less expensive than thermal-set adhesive. In addition, thermal-set adhesive requires the flex to be placed in a lamination press, which applies heat to cure the adhesive.

Belangrijke overwegingen bij het inhuren van elektronicaproducenten

Belangrijke overwegingen bij het inhuren van elektronicaproducenten

The quality of products produced by an electronics manufacturing company is a key determining factor for its success in the market. Companies that hold quality certifications are an added bonus. Moreover, it is important for a company to target a specific market for its product. In addition, the company should have the right market targeting strategy and must have quality certifications to support this claim.

Product development and production are important considerations while hiring electronics manufacturing companies

The process of developing and producing electronic products is an important part of the electronics manufacturing process. The two components work together to create products that meet client specifications. There are many types of products that are manufactured in this industry. Consumer products include the items that we use every day, while industrial products are used by industries such as aerospace and automotive. Military products are used by nations’ armed forces.

When hiring an electronics manufacturing company, there are several factors that you should keep in mind. First, you need to develop your team. The team should include employees, partners, suppliers, and vendors. The employees are in charge of producing the goods, while the partners and suppliers supply equipment and raw materials. Finally, the vendors are in charge of selling the products to the end users. Another consideration is finances. You should keep track of your expenses using accounting software, or you should hire a bookkeeper to handle the books.

Quality control is another important consideration. A quality control system helps to reduce losses and setbacks and keeps costs low. Similarly, quality control helps to ensure compliance with government regulations. In some industries, such as the automotive industry, the output of the product may directly affect the lives of consumers. Therefore, a company should never skimp on quality control just to save money.

Quality certifications are added bonuses to any quality assurance in electronics manufacturing

Although quality standards in the electronics industry have become a top concern, quality certifications are not mandatory. This means that electronic contract manufacturers, small and medium-sized businesses, and even some government agencies do not need to receive quality certifications in order to provide services. However, quality certifications are often required by defense contractors, government agencies, and the transportation industry.

Choosing an electronics manufacturing company with ISO certification will help you save time and money and increase your customer’s satisfaction. In addition, choosing a certified company will give you a peace of mind knowing that their processes are of a high standard and that they are continually improving.

Aside from improving the manufacturing process, quality certifications will help you improve your products and communicate with vendors. Consistency in quality is a vital factor for success and profitability in manufacturing. In electronics, consistency is critical. Compliance with standards and specifications will increase customer satisfaction and brand reputation.

Targeting markets is critical to success in the electronics manufacturing business

If you have an idea for an electronics manufacturing business, you need to target markets for your products. This can be accomplished in two ways: product development and production. Product development involves the design and creation of new products and production involves building products that meet client specifications. There are two main types of products to target: consumer products, which are items that we use on a daily basis, and industrial products, which are products used by industrial or military forces all over the world.

Regardless of the type of electronics manufacturing business, it’s important to understand the demographics of the target markets. Market segmentation can be done on a variety of bases, including gender, age, and income level. Demographic segmentation can give you a list of groups that are most likely to purchase your products. Psychographic segmentation, on the other hand, can help you target the most profitable market segments.

In addition to identifying the most profitable markets, you also need to understand how global markets are impacted by events such as Ebola. The Ebola outbreak will impact countries outside Germany, including the United States, China, and India. This will affect the automotive, computer, and communications sectors. It could also increase the need for remote monitoring devices that will allow businesses to continue working even during a lockdown situation.

Problems with hiring in the electronics manufacturing sector

With the skills gap in the electronics industry becoming more acute, companies must adapt to retain good employees and attract new ones. This means offering incentives such as flexible schedules, referral bonuses, and better salaries. Hiring good talent is essential to the long-term success of an organization, so employers need to look for ways to keep employees happy and engaged. A key element of successful hiring is candidate assessment, especially soft skills, which should be emphasized.

Wat is de functie en het principe van PCB Via Hole?

Wat is de functie en het principe van PCB Via Hole?

Een PCB via gat is een open gat dat door een PCB geboord wordt. De wand van het gat is gecoat met een platingoplossing, waardoor elektrische signalen door het gat kunnen stromen. Bij het boren van een via-gat is het belangrijk om de regels van de fabrikant te volgen om de juiste diameter en aspect ratio te garanderen. De minimale afstand tussen aangrenzende vias moet ook in acht worden genomen.

Gaten

PCB through-hole vias worden vaak gebruikt voor signaalovergangen op printplaten. Er zijn verschillende soorten doorvoeringen, waaronder blinde doorvoeringen, ondergrondse doorvoeringen en microdoorvoeringen. Elk type vias vereist een bepaalde procedure tijdens de plaatsing. Deze vias worden geplaatst tijdens de routingfase van het ontwerpproces en kunnen ofwel handmatig geplaatst worden of automatisch geplaatst worden met behulp van EDA-software. Door PCB via ontwerpregels te volgen, kan een printplaat worden vervaardigd volgens de exacte specificaties die het nodig heeft.

Het principe en de functie van PCB through-hole vias is om het signaal weg te leiden van het pad. Dit wordt meestal gedaan met behulp van een soldeermasker. Zo wordt voorkomen dat soldeerpasta in de doorgang trekt, wat kan leiden tot verbindingsfouten. Als een via echter in een boorgat van een pad zit, kan het soldeermasker niet op de via gebruikt worden, wat een betrouwbaarheidsprobleem oplevert tijdens de assemblage.

Ingegraven vias

Ingebakken vias worden gebruikt om de schakelingen op een PCB uit te breiden zonder de grootte of het gewicht van de printplaat te vergroten. Ze worden gemaakt met een ander proces dan een standaard dubbelzijdige PCB. In tegenstelling tot andere types van buried vias hebben ze geen invloed op surface mount componenten of sporen.

Ingebakken vias worden vaak gebruikt om ontwerpredenen, zoals het voldoen aan componentdichtheidseisen. Ze verkleinen ook de grootte van de printplaat, maar het proces vereist ook meer nauwkeurige controles en stappen in het productieproces. Ingebroken vias zijn ook goedkoper om te produceren, maar dan moet je wel een gerenommeerde elektronicapartner met contractproductie gebruiken voor het project.

Microvias

Microvia's zijn gaatjes met een kleine diameter die geplateerd zijn. Ze worden gebruikt om de bedradingsdichtheid te verhogen en het aantal lagen op de printplaat te verminderen. Microvia's verminderen ook de behoefte aan vias met doorlopende gaten en maken een kleinere totale padgrootte mogelijk. Ze zijn ook een van de meest kosteneffectieve methodes om de bedradingsdichtheid te verhogen. Dit artikel richt zich op de voordelen van microvia's en hoe ze u kunnen helpen om uw ontwerp beter te laten werken.

Microvia's worden gebruikt om het aantal gaatjes op een printplaat te verminderen. Ze kunnen zo klein zijn als 15 um in diameter. Deze techniek vergt meer tijd en inspanning, maar heeft aanzienlijke voordelen. Microvia's bieden ook een betere signaalintegriteit omdat ze kortere verbindingspaden hebben met minder parasitaire inductantie.

Anilineaire ring

Het PCB via-gat is een gat dat door alle lagen van de PCB wordt geboord en met koper wordt bedekt voor de elektrische verbinding. Dit gat heeft een cilindrische vorm en een dunne diameter. De diameter en sterkte zijn afhankelijk van de diameter van het koperen pad eromheen.

PCB vias kunnen van verschillende materialen gemaakt worden. De materialen die gebruikt worden in vias zijn vaak gemaakt van verschillende metalen. Vias zijn meestal gemaakt van koper of epoxy. Het gebruik van via-in-pads minimaliseert de PCB-ruimte, wat resulteert in kleinere printplaten. Deze praktijk kan echter lastig zijn omdat solderen de via-gaten kan opvullen. Daarom wordt aanbevolen om zo weinig mogelijk via-in-pads te gebruiken.

Betrouwbaarheid

Bij het ontwerpen van een printplaat is het belangrijk om na te gaan hoe betrouwbaar de printdoorvoer is. Als het niet betrouwbaar werkt, kan dit tot betrouwbaarheidsproblemen leiden. Betrouwbaarheidsproblemen kunnen ook het gevolg zijn van soldeerlekkage in de via. Deze webinar helpt u te begrijpen waarom de betrouwbaarheid van PCB via-gaten belangrijk is en biedt enkele oplossingen.

De betrouwbaarheid van een printdoorvoergat hangt af van de grootte. Er zijn twee basistypen via-gaten: blinde vias en ondergrondse vias. Beide zijn belangrijk voor de signaalintegriteit omdat ze ruis en EMI verminderen en scheuren en delaminatie helpen voorkomen. Over het algemeen moet de grootte van een PCB via-gat zes tot 150 micrometer zijn.

Voordelen

PCB via-gaten zijn een uitstekende manier om de betrouwbaarheid van uw printplaten te garanderen. Ze zorgen ervoor dat de printplaat kan worden geplateerd zonder dat er lucht of andere vloeistoffen in opgesloten raken. Door deze techniek te gebruiken, kunt u de betrouwbaarheid van uw printplaten verhogen en de assemblageopbrengst verbeteren. Dit proces is ook zeer effectief om het risico op holtes te minimaliseren.

PCB via hole-technologie is een populaire methode voor signaaloverdracht. Deze techniek plaatst koperen pads rechtstreeks op de via in plaats van een signaalspoor weg te leiden van het koperoppervlak van de component. Dit proces vermindert ook de hoeveelheid ruimte die nodig is voor het frezen van sporen. Deze methode wordt meestal gebruikt bij BGA-componenten met pitches van 0,5 mm en kleiner. Het gebruik van deze technologie vermindert de lengte van signaalpaden en vermindert zowel de capaciteit als de parasitaire inductantie.

Het verschil tussen FFC- en FPC-bedrading begrijpen

Het verschil tussen FFC- en FPC-bedrading begrijpen

If you’re thinking of replacing or upgrading your wiring, you should know the difference between FPC and FFC cables. The former is thicker and has two layers of wire sandwiching the insulation point. The latter is thinner and has a single conductor layer, saving space. Both types are available in a variety of sizes and shapes. In fact, FPCs are available in as small as 0.15mm.

FPC

The first thing that you need to know is that there are two types of flexible printed circuits. They differ from each other in several ways. First, a single-layer circuit has only one conductor layer while a multilayer circuit has multiple layers. Single-layer circuits are generally cheaper to produce than double-sided circuits.

Another major difference between FFC and FPC is the thickness of the cables. The former is much thinner than FFC and is generally between 0.5 and 0.8mm. The latter is typically between 1.5 and 2.54mm thick. While they are both flexible, they are not as versatile as flexible flat cables.

While the two kinds of flexible cables are similar, FFC is more versatile and often requires less space. It also offers better EMI/RFI suppression and eliminates wire coupling problems.

IDC

One of the most important factors in IDC wiring is the type of connector used. There are a few different types available. The first type is the traditional two-piece IDC connector. This design is used in many applications and has many advantages. For example, it can save space, reduce bill of materials and simplify assembly. It also eliminates the need to use a complementary mating connector.

The second type is the flat flex cable. This cable is very thin and can be used in many applications. For example, it is commonly used in laptops and keypad cables. It is also used in printers to connect to the printhead. While the two types are similar, there are a few major differences.

IDT

If you’re planning to install new wiring in your PC, it’s essential to understand the difference between FFC and FPC wiring. While both types of cables are conductive, FFC wiring has advantages over FPC in a few ways. First, FPC cables are generally thinner. They range in thickness from 0.15mm to 0.2mm. They’re also relatively inexpensive, and they’re easy to install. However, one disadvantage is that connecting FPCs to FFCs can be complicated.

Another major difference between FFC and FPC wiring is their pitch. While FFC cables have straight through conductors, FPCs can have bent or angle conductors. As such, FPCs are better suited for board-to-board interconnect.

Typical applications

Typically, FFC and FPC are used in the same applications, such as antennas, LCD televisions, cameras, laptops, printers, and aviation. These two types of flexible wires have some differences, however. For example, flexible printed circuits are made of FCCL (Flexible Copper Clad Laminate), while flexible flat cables are made of polyethylene terephthalate (PET), copper wires, and a polyethylene terephthalate coating.

Typically, FFCs are used for straight-through wiring, while FPCs have bends, angles, and other designs. While FFCs are the preferred choice for data cables, FPCs are more flexible and can be used in more applications.

Wat zijn de meeste problemen met SMT footprint?

Wat zijn de meeste problemen met SMT footprint?

SMT footprint is widely used for implementing microcontrollers. However, there are several problems related to SMT. Here are the common ones: Insufficient solder, thermal imbalances, and misplacement of components. These problems can also be caused by faulty part name, library name, and footprint.

Misplacement of components

If a component is dropped rather than placed on a surface mount footprint, the result can be a faulty PCB. In this case, a modification is necessary to the design to ensure that all parts are visible from above. In such a case, AOI may be used to detect the fault before the reflow process begins.

A bad placement of SMT components can lead to poor performance and even board failure. It is very important to place parts according to the schematics in order to avoid these problems. It is also important to keep analog and digital components separated and allow for clear signal return paths on the reference plane.

Thermal imbalances

SMT footprints can be a problem because they do not allow the proper amount of solder to reach the in-circuit test points. This can lead to poor solder joints, especially if the component is wave-solderable. However, this issue can be avoided by properly building the PCB footprint. To do this, it is important to remember to create the pads of the part to be large enough to contain solder paste. When the pads are too small, too much solder may flow over to another pad, causing bridging. This can be caused by improperly created pads or solder paste masks. It can also happen if the parts are placed too close together.

Another problem with smt footprints is the uneven amount of copper on both sides of the footprint. This can lead to component misplacement and thermal imbalance. In order to avoid this problem, PCBs should have a balanced copper distribution. It is also important to have the proper reflow profile to reduce delta T. This will also improve the surface finish of the PCB. The presence of moisture trapped within the component can also lead to thermal imbalances. Hence, PCBs should be stored in a humidity cabinet or pre-baked before use.

Insufficient solder

SMT footprint problems occur due to excess solder, which can flow into the wrong places during the soldering process. This can cause shorts or electrical problems. It also makes the solder look dull. Excess solder can also be caused by improper design, with pads and traces being too small or thin.

Often, SMT parts placed too close to in-circuit test points interfere with the ability of the test probes to make contact. Another common problem with SMT parts is that larger components may be placed in front of the smaller ones, causing shadowing. Designers should place smaller components in front of the larger components to avoid this problem.

Insufficient solder can cause poor strength and weak joints. Insufficient wetting can also lead to a metal oxide layer on the bonded object. Solder paste must be properly applied to both the pads and the pins to ensure that the joint will remain strong.

Pad-to-pin mismatch

A problem with pad-to-pin mismatch in SMT footprint can lead to insufficient solder. This problem can cause a circuit board to be rejected from a manufacturer. There are several ways to avoid it. First, always use the right footprint library. It will help you select the right size of component pads. Secondly, keep in mind that the distance between the pad edge and the silkscreen must be the same.

Second, an incorrectly matched pad is likely to result in impedance mismatch. The problem can occur at a number of locations, including board-to-board connectors, AC coupling capacitors, and cable-to-board connectors.

Het verschil en de rol van soldeermasker en plamuurmasker op printplaten

Het verschil en de rol van soldeermasker en plamuurmasker op printplaten

Printplaat (PCB)

De dikte van het soldeermasker en het pastamasker op printplaten is een belangrijke factor bij het bepalen van de elektrische eigenschappen van een printplaat. Het kan ook de veiligheid en haalbaarheid van PCB assemblage bepalen. De aanbevolen dikte varieert van 8 tot 15um.

Met de Cadence Allegro PCB Editor kunt u de laagconfiguratie van het pastamasker en soldeermasker bepalen. U kunt ook de breedte en materialen van elke laag definiëren. Dit helpt u bij het plannen van laagstapeling voor productie. De tool bevat ook een E-Book met informatie over laagstapelingsstrategieën.

Het kleurengamma van soldeermaskers is breed. Naast groen zijn soldeermaskers ook verkrijgbaar in blauw en wit. Sommige ontwerpers gebruiken liever verschillend gekleurde soldeermaskers om hun printplaten herkenbaarder te maken of om prototypes te onderscheiden van afgewerkte producten. Het gebruik van soldeermaskers kan echter heel wat problemen veroorzaken bij de productie van printplaten. Als het niet op de juiste manier wordt gebruikt, kan het leiden tot printplaten van mindere kwaliteit en een kortere levensduur.

Het soldeerpastamasker moet gelijkmatig worden aangebracht. De dikte van het pastamasker moet binnen een tolerantiebereik van 0,2 tot 4 mils liggen. Deze regel is belangrijk om ervoor te zorgen dat de soldeerpasta gelijkmatig en volledig wordt aangebracht. De ruimte tussen de soldeerpasta en de koperdraden is ook belangrijk. Deze regel is beschikbaar in populaire CAD-software en is een essentiële regel om PCB-soldeermaskerproductie van hoge kwaliteit te garanderen.

Het soldeerstopmasker of pastamasker is een dun laagje materiaal op het oppervlak van de printplaat dat voorkomt dat soldeer op de koperen sporen lekt. Het masker voorkomt ook dat oxidatie de printplaat beschadigt. Verder voorkomt het corrosie door schade door blootstelling aan chemicaliën te voorkomen.

Kritische toepassingen vereisen het hoogste prestatieniveau. Deze borden moeten zo worden ontworpen dat de service niet wordt onderbroken. Dit zijn meestal krachtige commerciële of industriële producten. Ze hoeven echter niet levenskritisch te zijn. Als de apparatuur bijvoorbeeld continu moet functioneren, is het noodzakelijk om ervoor te zorgen dat de PCB-pastamaskers beide herbruikbaar zijn.

Het soldeermasker kan worden aangebracht met een rakel of via een vacuümlamineerproces. Voor grote productieruns kunnen stencils worden gebruikt. De stencils worden meestal met laser gefabriceerd met dezelfde gegevens als het pastamasker. Bovendien worden de stencils behandeld met verschillende materialen om een hoge precisie en duurzaamheid te garanderen.

PCB pastamaskers en soldeermaskers zijn in wezen een onderdeel van de printplaat zelf. Het pastamasker is een stencillaag die kleiner is dan de eigenlijke PCB-pads. Het soldeerpastamasker heeft een overeenkomstig gat in het masker dat overeenkomt met de soldeerverbindingen.

Soldeermaskers worden op verschillende manieren gemaakt. Soldeermaskers kunnen worden aangebracht als een droge film of als een dunne, ondoorzichtige film. Het applicatieproces voor beide maskers is vergelijkbaar, maar elke methode gebruikt een andere methode om het eindproduct te maken. De eerste methode, LPSM genaamd, gebruikt een fotofilm om het soldeermasker bloot te leggen. Dit proces laat de film uitharden en eventuele luchtbellen verwijderen.