Tavsiye Edilen 4 Ücretsiz PCB Tasarım Yazılımı

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Tavsiye Edilen 4 Ücretsiz PCB Tasarım Yazılımı

If you’re new to PCB design, you might be interested in learning how to use free PCB design software. There are several different options available to you, including the popular Altium CircuitMaker, EasyEDA, PCB123, and ZenitPCB. All of these softwares are suitable for most novice designers, and are extremely easy to learn and use.

EasyEDA

EasyEDA is one of the most popular PCB design softwares available for free online. It is used by over two million people, including makers, electronics engineers, students, and educators. Its user-friendly interface makes it easy to use and understand. There are also courses and tutorials available to help you learn how to use the software.

EasyEDA offers advanced features including schematic capture, simulation, PCB layout, and 3D visualisation. It works on the cloud and has an extensive library of PCB components. It allows you to save and share your work privately and easily collaborate with other users. EasyEDA also supports Altium, KiCad, and LTspice schematic files. The software also includes a free PCB realization service.

ZenitPCB

Whether you are a budding electronics designer or are just looking for a free tool to design circuit boards, you have many options when it comes to PCB design software. Fortunately, there are a few leading free PCB design softwares that can do a professional-level job. These PCB design softwares are easy to use and will produce competent results.

ZenitPCB offers a clean, straightforward interface with the main workspace in the center. Quick keys and application buttons allow you to navigate between different tools and functions. The interface also features an easily navigable parts library, available netlists, and shortcuts for different operations. There is a GerberView button that can help you view and print out schematics and other electronic schematics.

PCB123

Whether you are an engineer new to PCB design or a seasoned pro, you can always turn to PCB123 for help. Its user manual walks you through the basics and explains how the software functions. It also provides useful tips and tricks on the best practices to follow when designing your PCBs. And it has a 3D view of your design to help you visualize all of the components.

PCB123 is a full-featured EDA tool that focuses on fast circuit design. Its suite of EDA tools include a BOM management system, real-time design rule checking, and a large online parts library with over 750,000 predefined parts. The software also includes a 3D rendering view to help you visualize and inspect your components and the board’s layout.

Pulsonix

Pulsonix pcb design software offers a wide range of design features and advanced technology. This PCB design software supports component placement and routing modes, as well as advanced post processing capability. It also has the industry’s largest import filter, allowing you to maintain Intellectual Property (IP). Other features of Pulsonix include complete assembly variants, interactive push-aside routing, constraint-driven design, and rules-based design. The company has sales channels all over the world.

The user-friendly interface of Pulsonix PCB design software facilitates easy and quick creation of schematic drawings. It also facilitates reuse of circuit elements. In addition, it offers automatic electrical rules checking. Finally, it allows users to import and export data, ensuring accuracy in design.

The Difference Between Rigid Flex Board Assembly and Multi Plate System Assembly

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The Difference Between Rigid Flex Board Assembly and Multi Plate System Assembly

One of the differences between rigid flex PCB and multi plate system assembly is the materials used for the substrate. In rigid flex PCB, the substrate material is typically woven fiberglass or an epoxy resin. However, these materials are not as reliable as polyimide.

Stiffeners

When constructing a multi plate system with a rigid flex board, the placement of stiffeners is an important part of the assembly process. These components are often applied using either a pressure sensitive or a thermal set adhesive. The former is less expensive, but it requires the flex PCB to be placed back in a lamination press, where it will be cut to the desired stiffener shape.

When choosing a rigid flex board, be sure to carefully consider the number of bends and where stiffeners will be applied. The type of bend is also an important consideration. For example, you can use a static bond or a dynamic bond, and one type is more durable and flexible.

Another option is a segmented plate element joint, which is composed of multiple plate elements connected by pins and rotational springs. This type of joint allows for reasonable bending stiffness, but it can be tedious to create.

Flexible PCBs

Whether you’re a designer or a manufacturer, you probably already know that flexible PCBs are a common component of electronics. Circuit boards are vital for many kinds of devices, and these days, they’re more flexible than ever before. The components of these boards are the same as those found in rigid PCBs, but the board can be bent to the desired shape during application. A flexible PCB is usually composed of a single layer of flexible polyimide film, which is then covered with a thin layer of copper. This copper layer is the conductive layer, and it’s only accessible from one side.

Flexible PCBs are also designed differently than traditional PCBs. The flexibility of these boards is an advantage, but the process of assembly is more complicated. The flexible board’s shape can be too complex for a single assembly, or it can result in failure. This means that PCB designers need to take special precautions when designing these boards.

Card edge connectors

Card edge connectors are an excellent option for interconnecting multi-plate and rigid flex board assemblies. These connectors have an array of capabilities that help meet a wide variety of signal requirements. For example, they can handle low-level, controlled impedance signals, high-speed signals, and even higher current carrying requirements. Additionally, their versatility allows them to fit into a variety of enclosures. This type of connector is also more cost-effective than many other connector types, thanks to their lower-point-of-interconnection and locking/high retention force designs.

Card edge connectors can be formed in many different shapes, including rounded and radiused edges. These edges are typically formed using a router or equivalent shaping tool. In addition, printed circuits are typically made from polyimide (1 or 2 mil thick), which is fabricated in flat sheet form. Copper circuitry is then adhered to the polyimide sheet using standard photo lithographic techniques.

Card edge connectors can be gold or nickel-plated. In addition to tin, these connectors can be nickel-plated or gold-plated. The plated metal is usually nickel or gold-plated to provide a good surface for copper circuitry.

Cost of assembly

The cost of rigid flex board and multi plate system assemblies varies depending on the number of boards and components required. Rigid flex PCBs are an excellent alternative to wire harnesses. These flexible PCBs are made of multiple layers with copper insulators connected by vias or plated through holes. These boards have low cost and high reliability and are a common choice for replacement of wire harnesses.

Cost of rigid flex PCB and multi plate system assembly may be more expensive than traditional PCB assembly methods, but the overall manufacturing cost is lower. By eliminating the need for board-to-board connectors, rigid flex PCBs and multi plate systems save space and manufacturing costs.

Rigid flex PCBs are coated with protective materials to prevent damage from heat and chemicals. These materials are widely available and are inexpensive. They are also excellent insulators and resist flames. Rigid flex PCBs are also used in computer motherboards and in transmitting information.

Solder Bridge of Wave Soldering Causes and Solutions

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Solder Bridge of Wave Soldering Causes and Solutions

In the process of soldering components, a problem called Solider bridge of wave soldering can occur. The problem can be caused by a variety of factors. Here are some causes and solutions. Listed below are three possible causes of this problem. The first reason is a result of improper soldering.

Solider bridge of wave soldering

Solider bridges are made by joining two soldered leads. Unlike traditional soldering, wave soldering uses an elastic barrier to separate the leads from the solder. This barrier protects the solder from oxidation and helps to maintain the high surface tension of the solder.

Wave soldering offers better accuracy than manual welding, but it also has certain drawbacks. The curing temperature is high, and the quality of the adhesive can be poor. Wave soldering can also lead to a dirty PCB surface, especially on large and uneven PCBs. It’s also possible for the solder to come off the PCB because of a high flux content or an extreme preheating temperature.

Wave soldering can also result in solder bridges between adjacent SOD components. Solder bridging is a serious defect because it can cause an electrical short. Another problem is the tombstone effect, in which a component is lifted during wave soldering. This is often the result of using components with different solderability requirements or utilizing the wrong lead length.

Problem

A solider bridge can occur when solder is applied across the last pad of a soldered connection. This can occur in a number of different ways. Often solder thieves are located adjacent to the last set of pads, or in a soldering arc. Fortunately, there are ways to prevent solder bridges.

Solder bridging is a common soldering defect that can lead to electrical shorts. In wave soldering, solder may flow between two connectors, which can lead to this problem. Incorrect lead lengths and using different solderability requirements are two common causes of solder bridges.

Another common cause of a solider bridge being dropped from the wave is an improper solder pot temperature. If the temperature of the solder pot is too high, the solider bridges will break off. Several factors can affect this problem, including flux type and quantity, as well as the angle at which the component is traversed through the wave.

Causes

Solider bridge of wave soldering can be caused by several factors. First, a low preheat temperature can fail to activate the flux. In such a case, the excess solder is often drawn back to the wave. Also, a small amount of excess solder can create a bridge.

Second, the solder thief can be a cause of solder bridges. In general, this phenomenon occurs in through-hole connections with components that are less than 100 mils apart. Solder thieves can be very useful in these cases, though they are not required in all cases. If you do not want to use a solder thief, choose components with larger centers-to-center spacings. This will minimize the possibility of a solider bridge.

Another cause of solder bridges is the oxidized surface of the components. The oxidized surface of the component will make it more difficult for the solder to adhere to it. This is due to the fact that surface tension causes the solder to repel the oxidized surface.

Solution

Solder flow is not a continuous flow. The solder is spread across the board, forming a thin wave that reaches the bottom of the PCB. The front and rear baffles are curved so that the wave is flat. The bottom of the wave lies slightly above the front baffle, while the top is just above the rear baffle. The wave’s surface tension prevents the solder from flowing over the back baffle.

If the solder is applied to the board without sufficient oxygen, it will drop to the wave state. This will make it difficult to see the solder inside the board, but will still make the electrical connection. One solution for this problem is to increase the number of leads on the board. Alternatively, you can change the stencil design to prevent off-contact solder paste printing.

Wave soldering can be confusing. It has been around before most people were even born. Despite this fact, many people find it difficult to understand and control. Luckily, there are now automated methods for mass soldering.

What Are the Common Factors That Cause PCB Circuit Board Failure?

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What Are the Common Factors That Cause PCB Circuit Board Failure?

PCB circuit boards can fail for a variety of reasons. These include manufacturing defects, human error, and plating violations. While these reasons can’t be eliminated completely, they can be addressed during the design phase or during the CM’s inspection of the board.

Human error

Printed circuit boards (PCBs) are an integral part of any electronics product, so understanding why they fail is important. Many failure issues can be resolved through rework, but there are some situations where new PCB assembly is necessary. If you are faced with such an issue, partnering with an experienced PCB assembly company can help mitigate the chances of a costly, unsuccessful repair.

The process of manufacturing printed circuit boards is extremely complex. Even small mistakes and errors can affect the final product. Besides human error, other common factors that cause PCB circuit board failure include improper soldering and improper component installation. In addition, environment can affect the components. Therefore, the factory environment needs to be clean to avoid failure.

PCB circuit board failure can also be caused by physical damage. This can be the result of shock or pressure. For example, the device might have been dropped a long distance, smacked by an object, or disassembled with improper care. A faulty board may not be able to withstand these types of stresses.

Manufacturing problems

PCB circuit boards can fail for several reasons, including manufacturing problems. While some are easy to detect and fix, others require extensive repair by the contract manufacturer. Some common causes of PCB failures include poorly connected solder joints or misaligned pads. Additionally, improperly placed components or traces can affect PCB performance, and the presence of corrosive chemicals can damage the components.

PCB circuit board failures can also occur during assembly. Several factors can affect the quality of PCBs, including the humidity and temperature in the manufacturing environment. These factors must be controlled, so that the boards will perform as intended. Another possible cause of PCB failure is human error. Some people accidentally remove or bend components, leaving them in an unsuitable position.

A defect in the design of a PCB is the most common cause of board failure. Incorrect or faulty components may cause a short circuit, crossed signals, and other problems. In addition, improperly installed components may result in the board being charred. Other common problems related to PCB fabrication include insufficient thickness of the board, which results in bending or delamination. Improper insulation can also cause a voltage arc, which can cause the board to burn or short out. Poor connectivity between layers can also lead to poor performance.

Misplaced solders

A PCB circuit board can fail for many reasons. One of these factors is misplaced solders, which can lead to a short circuit or other problems. Another common cause is a scratched lamination. This can expose connections underneath the lamination.

During the manufacturing process, PCB components can be misplaced due to two factors. First, the component feeder may not be placed correctly, or it may not be fitted to the correct reel. Secondly, the PCB’s footprint may not be the same size, so a component that’s larger than it should be is likely to fail.

Another common factor that causes PCB circuit board failure is improper soldering. When soldering, solder residues can damage the panel. As a result, boards can develop conductive anodic filaments (CAFs), which are metal filaments that form on the exposed surface. This problem can also be caused by poor glass-resin bonding or PCB drilling damage. Additionally, thermal expansion differences weaken the bond after soldering. This can result in a faulty connection.

Violations in the plating

Violations in the plating process are one of the most common reasons for PCB circuit board failure. These imperfections in the coating process can interfere with other process materials, hindering the cure of the coating, and causing corrosive residues on the PCBs. These corrosive residues can lead to PCB failures and erratic behavior. The best way to prevent this problem is to follow design specifications. Also, using a conformal coating can prevent the boards from becoming contaminated while in operation.

A PCB circuit board can be very critical to the integrity of your electronics, but it’s also easy to overlook it when it’s being assembled. PCB failure can be caused by several factors, including faulty components or manufacturing mistakes. Violations in the plating can affect the board’s durability and reliability, and they can even compromise the safety of sensitive equipment.

Violations in the plating process can also cause a PCB to malfunction due to poor electrical conduction. As a result, the PCB may fail during testing or inspection. In some cases, the PCB may even become unusable due to improper hole cleaning and drilling.

PCB Design Strategies For Parallel Micro Strip Lines Based on Simulation Results

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PCB Design Strategies For Parallel Micro Strip Lines Based on Simulation Results

Several PCB design strategies for parallel micro strip lines are presented in this paper. The first one deals with dielectric constant, Loss tangent, and Coplanar microstrip routing. The second one discusses application-specific PCB trace design rules.

Dielektrik sabiti

The dielectric constant of parallel micro strip lines can be computed by solving a series of differential equations. The dielectric constant h varies as a function of the substrate height and width. The dielectric constant is an important property of thin films, so it is important to obtain an accurate value for the dielectric constant.

A simulation can be used to compute the dielectric constant. The simulation results can be compared to experimental measurements. However, these results are not perfect. Inaccuracies can lead to inaccurate Dk values. This results in a lower impedance and a slower transmission rate. In addition, the transmission delay for a short line is longer than for long lines.

Parallel micro strip lines are characterized by a dielectric substrate with a relative dielectric constant of 2.2 and a corresponding dielectric loss of 0.0009. A microstrip line contains two parallel microstrip lines with a coupling line. The inner side of the microstrip line is loaded with a CSRR structure. The SRR transfers the electric field to the four sides of the microstrip line by means of the coupling line.

Loss tangent

To calculate the loss tangent of parallel micro strip lines, we use a computer simulation model. We use the loss tangent for a 30 mm-long strip line. Then, we use the length of the additional strip line to satisfy the connector spacing. This results in a loss tangent of 0.0007 deg.

The simulation results were very accurate and showed a good agreement with the experimental results. The simulation results indicated that the loss tangent of a parallel micro strip line is between 0.05 mm. This result was verified by further calculations. The loss tangent is an estimation of the energy absorbed by the strip. It depends on the resonant frequency.

Using this model, we can calculate the resonant frequency, loss tangent, and shunt frequency. We can also determine the critical cover height of a microstrip. This is a value that minimizes the influence of cover height on the line parameters. The computed output parameters are listed in the Line Types section of the guide. The program is very easy to use, allowing you to modify input parameters quickly and accurately. It has cursor controls, tuning shortcuts, and hot-keys to assist you in changing the parameters of the simulation model.

Coplanar microstrip routing

Coplanar microstrip routing can be performed using a computer simulation tool. The simulation can be used to optimize a design or to check for errors. For example, a simulation can determine whether a solder mask was present or not. Also, it can show the impact of etchback, which reduces coupling between coplanar trace and ground plane and increases impedance.

In order to make the correct coplanar microstrip routing, one must first compute the characteristic impedance between the coplanar waveguide and ground. This can be done with an active calculator or using the equations at the bottom of the page. The Transmission Line Design Handbook recommends a track width of “a” plus the number of gaps, “b.” The component side ground should be wider than b to avoid the effects of EMI.

To get accurate simulation results, one should use a good coplanar waveguide calculator. The best ones include a coplanar waveguide calculator that accounts for dispersion. This factor determines the loss and speed of different frequencies. Furthermore, one must account for copper roughness, which adds to the interconnect impedance. The best calculator will account for all these factors simultaneously.

Application-specific PCB trace design rules

The electrical field pattern on a PCB can be designed on multiple layers, single, double, or multi-layered. This type of PCB design is becoming more common, especially for SoC applications. In this design, the signal trace is routed on the inner layers of the PCB. The signal trace is backed by ground planes to minimize the characteristic impedance.

The simulated microstrip lines are designed with different cut-out widths. The reference 50 O microstrip has no cut-out compensation, while the other two have a discontinuity. The width-varying cut-out is used for impedance compensation, and the cut-out width is varied through linear parametric analysis. The cut-out width is 0.674 to 2.022 mm with a precision of 0.1685 mm.

The high integration requirements of parallel microstrip lines are often accompanied by crosstalk. To combat this problem, researchers have been exploring techniques to minimize crosstalk. They have studied the formation principles of crosstalk and identified factors that affect it. One of the most effective methods is to increase the spacing between transmission lines. However, this method uses limited wiring space and is not compatible with the direction of integration.

Yüksek Tg Baskılı Devre Kartı ve Uygulamaları

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Yüksek Tg Baskılı Devre Kartı ve Uygulamaları

High Tg printed circuit boards have a number of applications in aerospace. For example, jet engines produce thousands of micro vibrations per minute and require high Tg capabilities. Similarly, aircraft need to operate at temperatures ranging from -45degC to 85degC. In such environments, high Tg PCBs must be moisture-free and able to withstand a wide range of temperature.

TG170

TG170 high-tg PCB is a high-temperature-grade, high-resistance printed circuit board that can be fabricated in two different ways, using different materials. Its properties depend on the specifics of your design. This high-tg PCB is suitable for various electronic applications, including digital devices, medical equipment, and RF circuits.

High-TG PCBs are widely used in the automotive industry, and in measuring and power equipment. They are also used in solar power cogeneration equipment and in power inverters. They are also used in the automotive electronics industry, including navigation, telematics, and audio-video equipment.

Another application of TG170 high-tg PCB is in engine controls, where high temperature is an issue. High rotational speeds and long operating hours can result in high temperatures. In such conditions, tg170 high-tg PCB can withstand high temperatures and help reduce PCB failures.

High-TG PCBs have a lower sensitivity to heat, humidity, and chemical corrosion, which make them more reliable for electronics applications. Moreover, they are more suited for lead-free tin spraying processes. As the Tg is a crucial factor for a PCB’s mechanical stability, it is important to consider it in the design process. High-TG PCBs must be designed with appropriate materials that can withstand a high-temperature environment.

TG170 high-tg PCB is the ideal choice for high-performance electronics. These PCBs are a great option for high-end manufacturers. They can be used in a variety of applications and are available in a wide variety of materials and finishes.

High-TG PCBs are used in industrial applications where high-temperature, electrical, and chemical environments are a requirement. They are used in high-power pressers, drilling machines, power inverters, solar power equipment, and high-processing antennas. High-temperature PCBs can be made from a variety of materials, including glass, paper, or ceramics.

High-temperature circuit boards are required by the RoHS standard and are often used in electronics. High-temperature PCBs are ideal for RoHS applications as they can support lead-free soldering. They also improve the stability of PCB boards at moderate operating temperatures. In addition, high-temperature circuit boards are cheaper.

TG170 FR-4

In the design of printed circuit boards, temperature is one of the most important considerations. As the temperature of the PCB increases, the material expands and its properties change. This is why it is recommended that TG170 FR-4 PCB be used for systems that are not exposed to temperatures above 170 degrees Celsius.

High temperatures can affect FR4 materials and are detrimental to printed circuit boards. For example, high temperatures can affect crosslinking, which is crucial for FR4 materials. High temperatures can also impact segmental mobility and even cause the material to transition to a liquid state.

Proper documentation of the stacking-up plan is essential for successful high-TG PCB fabrication. The PCB manufacturer can help you develop the best layout for your circuits by providing the necessary specifications. Depending on your needs, you can choose FR-4, Rodgers, or Nelco materials. You can also route high-frequency signals to the inner layers to help insulate them from external radiation.

High-quality materials have longer life spans and improve performance. Therefore, you must look for PCBs with quality certifications. Major quality certifications include RoHS, ANSI/AHRI, ISO, and CE.

PCBs manufactured with TG170 FR-4 high-TG material are popular in many industries. The material’s higher Tg value improves moisture, heat, chemical resistance, and board stability. These properties make high-TG PCBs ideal for high-temperature circuits.

The properties of TG170 FR-4 high-TG PCB depend on the type of base material. Different weights of copper can be used in making a high-TG PCB. Because of this, different layers must be labeled separately. These layers will be separated according to their weight and thickness. This process helps in determining the proper thickness of high-TG PCB.

High-TG materials are often used in automotive applications. This is because they can handle higher temperatures and higher currents. However, a PCB must meet the temperature range (TUV) specified in its specifications.

 

PCB ve PCBA Arasındaki Fark Nedir?

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PCB ve PCBA Arasındaki Fark Nedir?

PCB ve PCBA arasında bir dizi fark vardır ve her birinin ürününüz için ne anlama geldiğini anlamak önemlidir. Farklılıklar malzemelerle sınırlı değildir, aynı zamanda bileşen yerleşimi, lehimleme ve çeşitli denetimleri de içerebilir. Baskılı devre kartları ayrıca sert veya esnek olabilir.

Baskılı devre kartı

Baskılı devre kartı, elektronik bileşenleri kontrollü bir şekilde birbirine bağlayan bir ortamdır. Bu kartlar elektronik ve elektrik mühendisliğinde yaygın bir malzemedir. Ayrıca yaygın olarak PCB olarak da adlandırılırlar. Baskılı devre kartları cep telefonlarından TV setlerine kadar her şeyde kullanılır.

PCB çok yönlü bir üründür ve çeşitli elektronik cihazlara uyacak şekilde özelleştirilebilir. Ayrıca tıbbi ekipman, aydınlatma ve otomotiv ekipmanlarında da kullanılırlar. Aslında, neredeyse her endüstriyel makine parçasında bulunurlar. Ayrıca elektronik ekipmanların bakım ve denetim maliyetlerini azaltmak için de kullanılırlar.

Bir PCB'nin yapım süreci, PCB substratı adı verilen bir temel malzeme ile başlar. Daha sonra kart bakır folyo ile kaplanır. Bakır folyo, bakır izleri içeren bir katmandır. Bu izler lehim tarafından yerleştirilir ve sıkıca yerinde tutulur.

Baskılı devre kartı tertibatlarının (PCBA) ortaya çıkmasından önce, bileşenler kabloların bileşenlere bağlanması ve sert bir alt tabakaya monte edilmesiyle paketlenirdi. Geçmişte bu malzeme, kontrplağın üst katının yerini alan bir malzeme olan bakalitten yapılıyordu. Daha sonra, iletken yollar oluşturmak için metal bileşenler üzerinde elle lehimleme yapılıyordu. Ancak bu işlem zaman alıyordu, çok sayıda bağlantı ve telden oluşuyordu ve kısa devrelere eğilimliydi.

Baskılı devre kartı ve pcb-a iki tür PCBA'dır. Her türün kendine özgü kullanımları ve faydaları vardır. Birleştirildiklerinde karmaşık bir elektronik montaj oluştururlar.

Baskılı devre kartı montajı

Baskılı devre kartı montajı, bir devre kartının tasarımıyla başlayan çok adımlı bir süreçtir. Bu tasarım daha sonra bakır kaplı bir laminat üzerine basılır. Daha sonra, açıkta kalan bakır kazınarak devre çizgilerinden oluşan bir desen bırakılır. Daha sonra delikler açılır ve elektronik bileşenler bu deliklere yerleştirilir. Bu süreç kritiktir çünkü her deliğin kartın bileşenlerine uyacak şekilde mükemmel boyutta ve hizada olması gerekir.

Baskılı devre kartı montajı, uzmanlık ve güvenlik önlemleri gerektiren son derece teknik bir süreçtir. Bitmiş ürün kusursuz olmalı ve elektronik aksamın montaj işleminden zarar görmesini önlemeye yardımcı olacak metal bir tırnak içermelidir. Baskılı devre kartı montajı onlarca yıldır yapılmaktadır ve halen elektronik ürün yapımında en popüler yöntemlerden biridir. Hem tek hem de çift katmanlı PCB'lerde kullanılabilir. Lehimsiz teknoloji gibi yeni teknolojiler, montajı daha güvenli ve kolay hale getirmekte ve baskılı devre kartlarının boyutunu ve ağırlığını azaltmaktadır.

Projeniz için doğru montaj teknolojisini seçerken, ihtiyaçlarınız için doğru olanı seçtiğinizden emin olun. Manuel lehimleme, alma ve yerleştirme makineleri ve yüzeye montaj teknolojisi dahil olmak üzere aralarından seçim yapabileceğiniz bir dizi yöntem vardır. Birçok pano yalnızca bir tür teknoloji gerektirirken, diğerleri birkaç tür gerektirir.

Baskılı devre kartı tasarımı

Baskılı devre kartı (PCB), elektronik bileşenler içeren baskılı bir devredir. Tipik olarak bir bakır katman, bir substrat ve bir serigrafiden oluşur. PCB'lerin ortaya çıkmasından önce, devreler genellikle bileşenlerin tellerle bağlanmasıyla oluşturulurdu. Bu teller daha sonra iletken yollar oluşturmak için bileşen uçlarına lehimlenirdi. Ancak bu yöntem yavaştı, üretimi zordu ve hata ayıklaması zordu.

Baskılı devre kartı tasarımı, devrenin ilk düzeni ile başlar. Kartın şeklini tanımladıktan ve bileşen verilerini şematikten içe aktardıktan sonra, bir sonraki adım PCB'nin fiziksel yerleşimidir. Başlangıç olarak, bileşen ayak izleri CAD sistemindeki kart taslağı içine yerleştirilmelidir. Bu ayak izleri ağ bağlantılarını hayalet çizgiler olarak gösterir, böylece kullanıcılar hangi parçalara bağlandıklarını görebilirler. Maksimum performans elde etmek için parçaları doğru şekilde konumlandırmak önemlidir. Bu, bağlantı, gürültü ve kablo ve montaj donanımı dahil fiziksel engellerin dikkate alınmasını içerir.

Tasarım onaylandıktan sonra, bir sonraki adım PCB için malzeme ve bileşenlerin seçilmesidir. Bu adım, tüm sürecin en zaman alıcı ve maliyetli adımıdır, ancak nihai ürünün başarısı için çok önemlidir. Bir kartın tasarım süreci, ana bileşenlerin belirlenmesi ve belirli bir tasarım için hangi laminat malzemelerin en uygun olduğunun belirlenmesiyle başlar.

En İyi 10 PCB Tasarım Aracı

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En İyi 10 PCB Tasarım Aracı

If you’re looking for a PCB design tool that is easy to learn and use, you’ve come to the right place. Here you’ll find a list of the top 10 best PCB design tools, including AutoTRAX DEX PCB, EasyEDA, and gEDA. These tools can be used by beginners as well as seasoned designers.

EasyEDA

EasyEDA is an excellent PCB design tool that is free and easy to use. Its design software features a huge library of more than 500000 component symbols and an extensive tutorial. The platform is also user-friendly and convenient to use from anywhere. This tool also comes with the option of ordering PCBs or prototyping.

The design program lets you create common libraries of parts with a few clicks. It supports direct links to over 200,000 real-time, in-stock components from LCSC. It also features a search bar that enables you to quickly locate any part you need.

gEDA

gEDA is a free tool that makes it easy to design and assemble PCBs. It is compatible with the most popular PCB layout software and supports multiple platforms. The gSch2pcb suite includes utilities for schematic/netlist import, checking design rules, auto-router, trace optimiser, and RS-247X data generation. gEDA also offers a gerber file viewer. Gerber files are used for many PCB operations and are the standard data format for PCB design.

gEDA is available under the GPL (General Public License), which means that users and authors are given certain rights. This allows gEDA to be free of vendor lock-in, independent of proprietary software, and available with full source code. Because of the GPL license, gEDA can be freely redistributed, improved, and ported to other platforms. Moreover, it is free and will always be updated.

AutoTRAX DEX PCB

The AutoTRAX DEX PCB design tool is a full-featured electronic development environment (EDA) with comprehensive tools for managing designs from concept to production. It can work in collaboration with MCAD and ECAD software, and manage design data and documentation to support the entire design process from concept to manufacturing.

AutoTRAX DEX PCB consists of integrated PCb design software and an intuitive hierarchical undertaking manager. It is an EDA for electronics engineers, with professional features that are essential to the 21st century electronic design industry. It’s a great solution for those looking for a powerful, user-friendly EDA that can replace antiquated methods.

Fritzing

If you are in the market for a PCB design tool, Fritzing is an excellent choice. This software features a clean user interface and provides all the necessary tools to create a quality circuit. It offers a range of options for editing the schematic, including changing the traces’ width and placement. It can also generate Gerber files. It also has a feature known as Auto Router, which can automatically route the copper tracks for you.

Fritzing is user-friendly and is perfect for beginners or anyone who has no prior experience in PCB design. The software allows you to connect Arduino boards and visualize the connections between components. It can also simulate circuits in order to verify accuracy. This can save you time and money, as you can avoid costly errors later.

ZenitPCB

ZenitPCB is a powerful PCB design tool that is free to download and use. It offers a lot of useful features for a beginner or a student. However, some users may find this tool lacking in some aspects, such as the ability to convert a schematic to a layout. Additionally, this PCB design software only supports a maximum of 1000 pins, which limits its usability.

ZenitPCB is easy to use and has a compact, intuitive interface. It is divided into several sections, including a main workspace, application buttons, quick keys, and project-related information. It also includes a library of parts and netlists, as well as shortcuts for various operations. It is also equipped with a free web-based autorouter.

PCB Tasarımı için Araçlar

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PCB Tasarımı için Araçlar

Gerber Panelizer

GerberPanelizer is an aide in creating a PCB design. It allows you to edit the layout and then export it as a final merged gerber file. Once exported, the gerber file is locked and cannot be edited or changed. The export will also contain image renderings.

However, it is not a perfect solution. While it is a great tool for panelizing boards, the tool is not very flexible. You need to add fiducials along the board edge and add M4 holes along one side. Nevertheless, the program is extremely easy to use and is an excellent tool for PCB design. It is currently being improved and will be updated in the next version.

Gerber Panelizer is a powerful tool for PCB design. It is very useful for people who build their own PCBs or who are interested in Open Hardware. One major drawback is that it is offered without support and is prone to breaking features. The GUI is window-based and mono.

The main screen of Gerber Panelizer has a list of all the CAM steps. Click on a step to view the contents. You may also click on the step name.

Gerber

When you generate a Gerber file in Altium Designer, you will be able to create multiple board layouts in a single file. Gerber files are files that describe your requirements for PCB fabrication and assembly. They include templates for solder mask, silkscreen pictures, and drill holes. This type of file can be exported to a PCB manufacturer.

You can also insert objects into the panel with the Add Insert command in the right-click menu. To insert an object in the board, you can place it in the parent step or campanel by right-clicking on the board. Make sure to remove the venting pattern that you previously applied. Otherwise, the data will appear without a border.

You can also create a single-sided design and export it as a Gerber. For this, you need to set the top layer of your CAM document to be “top” and then panelize PCB. Then, you can add the Gerbers to the boxes that will be created in the project.

Altium Designer supports the Gerber panelization feature and allows you to create board layouts with multiple designs. With the Gerber panelizer, you can design PCBs with odd shapes and multiple designs on the same panel.

KiKit

Creating panelized printed circuit boards can be a time-consuming process, and the best way to speed it up is by using the KiKit toolkit. It allows you to easily group boards into panels so that they can be reflow soldered together in a quick process. Normally, this requires manually grouping and assembling the boards, but KiKit makes it easy by creating a script that can gang up six boards in a single pass. It uses mousebites to hold them together, so that they can easily be separated after soldering is complete.

KiKit uses a Python-based script to organize the boards into a grid. The script is flexible enough to handle mousebites and v-cuts, and even allows for board separation after production. Since the PCB component distribution is so large, grouping them into panels makes the assembly process much faster. They can then be placed in a reflow oven or pick-and-place machine as one unit.

A panelized PCB needs adequate support to prevent accidental breakout. You can move panels around on the board and adjust edge clearances. Then, you’re ready to build your finished board. Just remember to create a margin of at least one inch on the board. You’ll need to do this for multiple layers.

The panelization process is critical to creating a custom PCB, and Altium Designer provides a host of tools for this task. This includes CAD and CAM features, and the ability to define panelized PCB. Additionally, it integrates design files with panelized PCBs so that it’s easy to make changes without re-making panels.

SMT Yamasında Yetersiz Lehim Parlaklığının Nedenlerinin Analizi

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SMT Yamasında Yetersiz Lehim Parlaklığının Nedenlerinin Analizi

Bir lehim bağlantısında yetersiz lehim parlaklığı çeşitli faktörlerden kaynaklanır. Bir bileşen yetersiz lehime sahip olabilir, uzun süre aşırı ısınmış olabilir veya yaş veya aşırı ısı nedeniyle lehim bağlantısında soyulmuş olabilir.

Soğuk lehimleme

SMT yamalarında yetersiz lehim parlaklığı sorunu genellikle yetersiz lehimlemeden kaynaklanır. Yetersiz lehim parlaklığı lehim bağlantılarını zayıflatabilir ve arızaya ve çatlamaya yatkınlıklarını artırabilir. Neyse ki, daha fazla lehim uygulamak veya bağlantıları yeniden ısıtmak da dahil olmak üzere sorunu çözmenin yolları vardır.

Yetersiz lehim parlaklığı, lehimleme sırasında yetersiz flux veya çok fazla ısıdan kaynaklanır. Yetersiz ıslatma, hem pimin hem de pedin eşit şekilde ısıtılmamasından veya lehimin akması için yeterli zamanın olmamasından da kaynaklanabilir. Bu durumda, yapıştırılan nesne üzerinde bir metal oksit tabakası oluşabilir. Bu gibi durumlarda, kartı temizlemek ve lehimi iki bileşene eşit şekilde uygulamak için bir onarım tekniği kullanılmalıdır.

PCB oksidasyonu

SMT yamasında yetersiz lehim parlaklığı çeşitli nedenlerden kaynaklanabilir. Yaygın sorunlardan biri yanlış lehim pastası depolama ve işlemidir. Lehim pastası çok kuru veya son kullanma tarihi geçmiş olabilir. Lehim pastasının viskozitesi de düşük olabilir. Ayrıca, lehim pastası yama sırasında kalay tozu ile kirlenebilir.

Tipik olarak, bu sorun PCB'ler uzun süre korumasız bırakıldığında ortaya çıkar. Zayıf lehim bağlantılarının bir başka yaygın nedeni de yüzeye monte pedin oksitlenmesidir. Oksidasyon, depolama veya nakliye sırasında PCB'nin yüzeyinde meydana gelebilir. Sorunun nedeni ne olursa olsun, bunun olmasını önlemek için adımlar atmak önemlidir.

Lehim bilyeleri

Lehim topları, bir devre kartının işlevselliği üzerinde ciddi sonuçlar doğurabilecek küçük lehim toplarıdır. Küçük toplar bileşenleri işaretin dışına taşıyabilir ve daha büyük toplar lehim bağlantı kalitesini düşürebilir. Ayrıca, kartın diğer kısımlarına yuvarlanarak kısa devre ve yanıklara neden olabilirler. Bu sorunlar, PCB taban malzemesinin yeniden akıtılmadan önce kuru olduğundan emin olunarak önlenebilir.

Lehimleme sırasında kullanılacak uygun lehim pastasının seçilmesi, lehim topları riskini en aza indirmede önemli bir unsurdur. Doğru macunun kullanılması, bir kartın yeniden işlenmesi olasılığını büyük ölçüde azaltabilir. Yavaş bir ön ısıtma hızı, lehimin yüzeye eşit olarak yayılmasını sağlayacak ve lehim toplarının oluşmasını önleyecektir.

Fazla lehim

SMT yama işlemlerinde aşırı lehim parlaklığı genellikle faktörlerin bir kombinasyonundan kaynaklanır. Birincisi, lehim bağlantısının görünümünü etkileyecek düşük bir ön ısıtma sıcaklığıdır. İkincisi ise lehim kalıntısının varlığıdır. İkincisi, lehim bağlantısının donuk ve hatta hissiz görünmesine neden olabilir.

Lehim pastasının şablona bulaşması bir diğer yaygın nedendir. Pasta düzgün bir şekilde yeniden akıtılmamışsa, fazla lehim akabilir ve lehim bağlantı bağlantısını gizleyebilir. Fazla lehimi temizlemek için lehim emici, lehim fitili veya sıcak ütü ucu kullanın.

Yanlış kaynak

Yetersiz parlaklığa sahip lehim bağlantıları yanlış kaynağın bir sonucu olabilir. Lehimin ıslanması zayıf olabilir, koyu veya yansıtıcı olmayabilir ya da iyi görünmeyecek kadar pürüzlü olabilir. Bunun altında yatan neden, lehimin tamamen erimesi için yeterince yüksek bir sıcaklığa ulaşacak şekilde yeterince ısıtılmamış olmasıdır.

Lehim pastası uygun şekilde karıştırılmadığı veya saklanmadığı için lehimleme işini yapamaz. Pasta, lehim banyosunda tamamen yeniden çözünmeyebilir ve lehimleme işlemi sırasında kalay tozu dökülebilir. Bir başka neden de lehim pastasının son kullanma tarihinin geçmiş olmasıdır. Bir SMT yamasında yetersiz lehim parlaklığının yedinci olası nedeni, lehim pastası tedarikçisi tarafından kullanılan üretim teknolojisinin bir sonucudur.

Lehim boşlukları

SMT yamalardaki lehim boşlukları bir bileşenin güvenilirliğini ve işlevselliğini olumsuz etkileyebilir. Lehim topunun kesitini azaltırlar, bu da ısı ve akım aktarabilen lehim miktarını azaltır. Ayrıca, yeniden akış sırasında, önceden var olan küçük boşluklar birleşerek büyük boşluklar oluşturabilir. İdeal olarak, boşluklar ortadan kaldırılmalı veya yönetilebilir bir seviyeye indirilmelidir. Bununla birlikte, birçok çalışma orta düzeydeki boşlukların çatlak yayılımını azaltarak ve lehim bağlantısının yüksekliğini artırarak güvenilirliği artırabileceğini göstermektedir.

SMT yamalardaki lehim boşlukları, nadiren meydana geliyorsa ve güvenilirliği etkilemiyorsa ciddi bir sorun değildir. Bununla birlikte, bir üründe bulunmaları, üretim parametrelerinde ayarlama yapılması gerektiğine işaret eder. SMT yamalarında lehim boşluklarının varlığına, sıkışmış akı ve devre kartlarındaki kirleticiler de dahil olmak üzere bazı faktörler katkıda bulunabilir. Bu boşlukların varlığı, lehim topunun içinde daha açık bir nokta olarak göründükleri X-ışını görüntülerinde görsel olarak tespit edilebilir.