What Should We Pay Attention To When Soldering a PCB?

What Should We Pay Attention To When Soldering a PCB?

There are several factors that we should pay attention to when soldering a PCB. For example, we should avoid overheating the joint. Also, we should pay attention to ventilation. In addition, we should use lead-free alloys. If there are any problems with solder flow, we can contact the manufacturer and ask them to repair it.

Ventilation

Proper ventilation when soldering PCBs is critical to preventing respiratory problems. Using a local exhaust ventilation system helps remove the bulk of solder fumes, which can be inhaled. It is important to monitor air quality at your worksite to ensure that it is safe for everyone working in it.

The Hakko FA-400 is a good option for occasional soldering projects, but it is not suitable for workers who spend many hours in a day breathing in the fumes. Not only does the air quality affect the person soldering, but it also affects the area around him or her. This is due to the fact that drafts and currents will carry the fumes throughout the room. Therefore, it is necessary to invest in a filtration system to avoid these risks.

Residu fluks

Flux is a key part of soldering, as it removes oxides from the board’s surface, allowing the solder joint to be as strong as possible. The presence of oxides on the board can cause poor electrical conduction and lead to a poor solder joint. There are several types of solder flux available.

A typical flux is rosin. This type is most commonly used in electrical soldering.

Overheating joints

When soldering PCBs, one of the most common errors is overheating the joints. This problem occurs when soldering a joint is not done properly or when the soldering iron’s temperature is too low. To prevent this, be sure to pre-heat the iron before you begin.

Overheating joints will cause the solder to oxidize, which can cause damage to the electronics component. Insufficiently wetting the solder joint can also lead to tombstoning, which is when the solder pad does not complete the wetting process. Fortunately, this problem can be avoided by carefully inspecting the soldering process and using the correct tools.

Using lead-free alloys

Using lead-free alloys when soldered PCBs is an excellent option. They can be used to achieve a strong, durable joint without the risks of lead. Various fluxes are available to facilitate the process. When soldering PCBs, it is important to use the correct flux for the task at hand.

WS888 is a lead-free solder paste that meets the reliability requirements for PCB assemblies. It exhibits consistency and repeatability across a wide temperature and relative humidity range. It also leaves no residues on the PCB and is easily cleaned with water. In addition, NC722 is a no-clean lead-free solder paste that is designed for low-melting tin-bismuth alloys. It has excellent stencil life and leaves no flux residues. Moreover, NC722 is pin-testable and has a low melting point.

Clean connector bodies

The first step in soldering a connector is to clean the component’s body. Before starting the soldering process, make sure to clean the component’s body with alcohol or tissue. Next, apply liquid flux to all the leads on the component’s opposite side.

This is done to remove any surface contaminants. A scraper is a useful tool for this. It is also important to clean connector bodies because chrome plating can make it difficult to wet with solder.

Soldering iron

When soldering a PCB, it is important to watch the soldering iron tip. The tip should be larger than the gap between the electronic components on the board. For small components, a conical tip may be appropriate. Then, insert the component into the holes. The soldering iron tip should make contact with both the board and the lead. When both touch, the solder will be heated and the connection will be completed.

When soldering PCB, the tip of the soldering iron should be resting against the component lead. If the solder is not touching the lead, it will not adhere to it. The tip should be coated with solder and should form a mound. When the joint is completed, remove the iron and the solder should flow smoothly.

Soldering paste

Solder paste is a combination of metal solder particles and a sticky flux that provides a temporary adhesive that holds surface mount components in place. Solder paste comes in various types, each with a different viscosity and chemical composition. Some are lead-free, while others comply with the RoHS directive. Some solder pastes have an additive that is made from pine tree extract.

Soldering paste is usually applied using a stencil. It allows for the proper placement of solder and helps spread the paste evenly. Stencils help avoid applying too much or too little paste, which can result in weak joints and shorts between adjacent pads.

Keuntungan dan Kerugian Perpindahan Gulungan FPC

Keuntungan dan Kerugian Perpindahan Gulungan FPC

There are advantages and disadvantages to FPC winding displacement. It is a popular winding technique that helps prevent unwanted static buildup between two FPCs. It can also be used for reel-type packaging. In this article, we’ll discuss some of these factors.

fpc winding displacement

There are advantages and disadvantages of fpc winding displacement. One of the advantages is that it reduces the size and weight of the electronic product. It is useful for developing high-density, miniaturized, and high-reliability electronic products. It has been widely used in aerospace and military applications. Another advantage is that it allows the electronic component assembly to be integrated and rearranged according to the spatial layout requirements.

The advantages and disadvantages of fpc winding displacement can be derived from the installation process. First, the FPC connector assembly is placed in a relative position to the installation notch. It is then fixed to the circuit board by bending the fixed arms left and right. This process minimizes the overall height value of the installation structure and allows for the installation of the FFC 14.

fpc reel-type packaging

The advantages and disadvantages of fpc reel-type packaging are numerous. This type of packaging provides many advantages, such as reduced weight and size, and can be used for the development of miniaturized, high-density, and high-reliability electronic products. This packaging method has also found applications in the military and aerospace industries. The flexibility of this type of packaging allows for the assembly of electronic components in a flexible package.

FPCs are also easily transported to the processing machine through the use of a reel. This type of packaging offers a number of advantages, including preventing crumples caused by external force, a convenient supplying method, and an increase in throughput. A typical FPC reel-type package 58 is formed by winding bar-like materials 54 onto a reel. Once a reel is wound, a punching device 60 sequentially cuts the bar-like materials into a plurality of pieces.

fpc pre-press head

A fpc pre-press head is a tool used to transfer an FPC onto a glass substrate. It sucks up the FPC’s top surface and then transports it to a processing chamber, where the FPC is adhered to the glass substrate. The resulting photonic device can then be processed as a large scale integration chip or color filter.

The process system includes an FPC reel-type package, punching device, transporting arm, and pre-press head. The FPCs are formed by winding bar-like materials onto a reel. The punching device then cuts out each of the bar-like materials sequentially, while the transporting arm transports the cut FPCs to the final processing stage.

fpc pattern placement on flexible plate

An FPC pattern is a flexible plate that contains one or more electrical contacts. The circuitry can be either single or multiple sided. The FPC pattern should be assymmetrical as possible to minimize stress concentration. Several techniques are available to design a flexible plate with an optimal FPC pattern.

When creating a FPC pattern, the thickness of the plate must be equal to or slightly larger than the diameter of the board. It must also have an internal angle of at least 1.6 mm. An additional factor to consider is the bending radius ratio. A larger radius means a stronger board that is less likely to tear. Ideally, the board will be evenly oriented with no rough areas or sharp edges.

The FPC pattern placement on the plate can be automated by reel-type packaging. Reel-type packaging can deposit the FPC patterns in multiple layers and is an excellent option for a multi-layered FPC design. The PI material makes the FPC softer and prevents it from breaking during repeated bending. In addition, a double-sided adhesive fixing area should be included at the gold finger connector joint. This will prevent the gold finger connector from falling off the FPC during the bending process. The FPC placement screen should also be provided on the junction of the FPC connector to prevent the FPC from skewing during assembly.

Recommend 4 Free PCB Design Softwares

Recommend 4 Free PCB Design Softwares

If you’re new to PCB design, you might be interested in learning how to use free PCB design software. There are several different options available to you, including the popular Altium CircuitMaker, EasyEDA, PCB123, and ZenitPCB. All of these softwares are suitable for most novice designers, and are extremely easy to learn and use.

EasyEDA

EasyEDA is one of the most popular PCB design softwares available for free online. It is used by over two million people, including makers, electronics engineers, students, and educators. Its user-friendly interface makes it easy to use and understand. There are also courses and tutorials available to help you learn how to use the software.

EasyEDA offers advanced features including schematic capture, simulation, PCB layout, and 3D visualisation. It works on the cloud and has an extensive library of PCB components. It allows you to save and share your work privately and easily collaborate with other users. EasyEDA also supports Altium, KiCad, and LTspice schematic files. The software also includes a free PCB realization service.

ZenitPCB

Whether you are a budding electronics designer or are just looking for a free tool to design circuit boards, you have many options when it comes to PCB design software. Fortunately, there are a few leading free PCB design softwares that can do a professional-level job. These PCB design softwares are easy to use and will produce competent results.

ZenitPCB offers a clean, straightforward interface with the main workspace in the center. Quick keys and application buttons allow you to navigate between different tools and functions. The interface also features an easily navigable parts library, available netlists, and shortcuts for different operations. There is a GerberView button that can help you view and print out schematics and other electronic schematics.

PCB123

Whether you are an engineer new to PCB design or a seasoned pro, you can always turn to PCB123 for help. Its user manual walks you through the basics and explains how the software functions. It also provides useful tips and tricks on the best practices to follow when designing your PCBs. And it has a 3D view of your design to help you visualize all of the components.

PCB123 is a full-featured EDA tool that focuses on fast circuit design. Its suite of EDA tools include a BOM management system, real-time design rule checking, and a large online parts library with over 750,000 predefined parts. The software also includes a 3D rendering view to help you visualize and inspect your components and the board’s layout.

Pulsonix

Pulsonix pcb design software offers a wide range of design features and advanced technology. This PCB design software supports component placement and routing modes, as well as advanced post processing capability. It also has the industry’s largest import filter, allowing you to maintain Intellectual Property (IP). Other features of Pulsonix include complete assembly variants, interactive push-aside routing, constraint-driven design, and rules-based design. The company has sales channels all over the world.

The user-friendly interface of Pulsonix PCB design software facilitates easy and quick creation of schematic drawings. It also facilitates reuse of circuit elements. In addition, it offers automatic electrical rules checking. Finally, it allows users to import and export data, ensuring accuracy in design.

The Difference Between Rigid Flex Board Assembly and Multi Plate System Assembly

The Difference Between Rigid Flex Board Assembly and Multi Plate System Assembly

One of the differences between rigid flex PCB and multi plate system assembly is the materials used for the substrate. In rigid flex PCB, the substrate material is typically woven fiberglass or an epoxy resin. However, these materials are not as reliable as polyimide.

Stiffeners

When constructing a multi plate system with a rigid flex board, the placement of stiffeners is an important part of the assembly process. These components are often applied using either a pressure sensitive or a thermal set adhesive. The former is less expensive, but it requires the flex PCB to be placed back in a lamination press, where it will be cut to the desired stiffener shape.

When choosing a rigid flex board, be sure to carefully consider the number of bends and where stiffeners will be applied. The type of bend is also an important consideration. For example, you can use a static bond or a dynamic bond, and one type is more durable and flexible.

Another option is a segmented plate element joint, which is composed of multiple plate elements connected by pins and rotational springs. This type of joint allows for reasonable bending stiffness, but it can be tedious to create.

Flexible PCBs

Whether you’re a designer or a manufacturer, you probably already know that flexible PCBs are a common component of electronics. Circuit boards are vital for many kinds of devices, and these days, they’re more flexible than ever before. The components of these boards are the same as those found in rigid PCBs, but the board can be bent to the desired shape during application. A flexible PCB is usually composed of a single layer of flexible polyimide film, which is then covered with a thin layer of copper. This copper layer is the conductive layer, and it’s only accessible from one side.

Flexible PCBs are also designed differently than traditional PCBs. The flexibility of these boards is an advantage, but the process of assembly is more complicated. The flexible board’s shape can be too complex for a single assembly, or it can result in failure. This means that PCB designers need to take special precautions when designing these boards.

Card edge connectors

Card edge connectors are an excellent option for interconnecting multi-plate and rigid flex board assemblies. These connectors have an array of capabilities that help meet a wide variety of signal requirements. For example, they can handle low-level, controlled impedance signals, high-speed signals, and even higher current carrying requirements. Additionally, their versatility allows them to fit into a variety of enclosures. This type of connector is also more cost-effective than many other connector types, thanks to their lower-point-of-interconnection and locking/high retention force designs.

Card edge connectors can be formed in many different shapes, including rounded and radiused edges. These edges are typically formed using a router or equivalent shaping tool. In addition, printed circuits are typically made from polyimide (1 or 2 mil thick), which is fabricated in flat sheet form. Copper circuitry is then adhered to the polyimide sheet using standard photo lithographic techniques.

Card edge connectors can be gold or nickel-plated. In addition to tin, these connectors can be nickel-plated or gold-plated. The plated metal is usually nickel or gold-plated to provide a good surface for copper circuitry.

Cost of assembly

The cost of rigid flex board and multi plate system assemblies varies depending on the number of boards and components required. Rigid flex PCBs are an excellent alternative to wire harnesses. These flexible PCBs are made of multiple layers with copper insulators connected by vias or plated through holes. These boards have low cost and high reliability and are a common choice for replacement of wire harnesses.

Cost of rigid flex PCB and multi plate system assembly may be more expensive than traditional PCB assembly methods, but the overall manufacturing cost is lower. By eliminating the need for board-to-board connectors, rigid flex PCBs and multi plate systems save space and manufacturing costs.

Rigid flex PCBs are coated with protective materials to prevent damage from heat and chemicals. These materials are widely available and are inexpensive. They are also excellent insulators and resist flames. Rigid flex PCBs are also used in computer motherboards and in transmitting information.

Jembatan Solder Penyebab dan Solusi Penyolderan Gelombang

Jembatan Solder Penyebab dan Solusi Penyolderan Gelombang

Dalam proses penyolderan komponen, masalah yang disebut jembatan Solider dari penyolderan gelombang dapat terjadi. Masalah ini dapat disebabkan oleh berbagai faktor. Berikut adalah beberapa penyebab dan solusinya. Di bawah ini adalah tiga kemungkinan penyebab masalah ini. Alasan pertama adalah akibat penyolderan yang tidak tepat.

Jembatan penyolderan gelombang yang kokoh

Jembatan penyolder dibuat dengan menyambungkan dua kabel yang disolder. Tidak seperti penyolderan tradisional, penyolderan gelombang menggunakan penghalang elastis untuk memisahkan kabel dari solder. Penghalang ini melindungi solder dari oksidasi dan membantu mempertahankan tegangan permukaan solder yang tinggi.

Penyolderan gelombang menawarkan akurasi yang lebih baik daripada pengelasan manual, tetapi juga memiliki kelemahan tertentu. Suhu pengeringan tinggi, dan kualitas perekatnya bisa buruk. Penyolderan gelombang juga dapat menyebabkan permukaan PCB kotor, terutama pada PCB yang besar dan tidak rata. Solder juga dapat terlepas dari PCB karena kandungan fluks yang tinggi atau suhu pemanasan awal yang ekstrem.

Penyolderan gelombang juga dapat mengakibatkan jembatan solder antara komponen SOD yang berdekatan. Jembatan solder adalah cacat yang serius karena dapat menyebabkan korsleting listrik. Masalah lainnya adalah efek batu nisan, di mana komponen terangkat selama penyolderan gelombang. Hal ini sering kali terjadi akibat penggunaan komponen dengan persyaratan kemampuan solder yang berbeda atau penggunaan panjang timah yang salah.

Masalah

Jembatan solider dapat terjadi ketika solder diterapkan di bantalan terakhir dari sambungan yang disolder. Hal ini dapat terjadi dalam beberapa cara yang berbeda. Seringkali pencuri solder terletak berdekatan dengan set bantalan terakhir, atau dalam busur solder. Untungnya, ada beberapa cara untuk mencegah jembatan solder.

Solder bridging adalah cacat penyolderan umum yang dapat menyebabkan korsleting listrik. Pada penyolderan gelombang, solder dapat mengalir di antara dua konektor, yang dapat menyebabkan masalah ini. Panjang timah yang salah dan menggunakan persyaratan kemampuan solder yang berbeda adalah dua penyebab umum jembatan solder.

Penyebab umum lainnya dari jembatan solider yang terjatuh dari gelombang adalah suhu pot solder yang tidak tepat. Jika suhu pot solder terlalu tinggi, jembatan solider akan putus. Beberapa faktor dapat memengaruhi masalah ini, termasuk jenis dan kuantitas fluks, serta sudut di mana komponen dilintasi gelombang.

Penyebab

Jembatan penyolderan gelombang yang tidak kokoh dapat disebabkan oleh beberapa faktor. Pertama, suhu pemanasan awal yang rendah dapat gagal mengaktifkan fluks. Dalam kasus seperti ini, kelebihan solder sering kali ditarik kembali ke gelombang. Selain itu, sejumlah kecil kelebihan solder dapat membuat jembatan.

Kedua, pencuri solder bisa menjadi penyebab jembatan solder. Secara umum, fenomena ini terjadi pada koneksi lubang tembus dengan komponen yang berjarak kurang dari 100 mil. Pencuri solder bisa sangat berguna dalam kasus ini, meskipun tidak diperlukan dalam semua kasus. Jika Anda tidak ingin menggunakan pencuri solder, pilihlah komponen dengan jarak pusat-ke-pusat yang lebih besar. Hal ini akan meminimalkan kemungkinan terjadinya jembatan solder.

Penyebab lain jembatan solder adalah permukaan komponen yang teroksidasi. Permukaan komponen yang teroksidasi akan mempersulit solder untuk merekat padanya. Hal ini disebabkan oleh fakta bahwa tegangan permukaan menyebabkan solder menolak permukaan yang teroksidasi.

Solusi

Aliran solder bukanlah aliran yang kontinu. Solder disebarkan ke seluruh papan, membentuk gelombang tipis yang mencapai bagian bawah PCB. Penyekat depan dan belakang dibuat melengkung sehingga gelombangnya rata. Bagian bawah gelombang terletak sedikit di atas penyekat depan, sedangkan bagian atas tepat di atas penyekat belakang. Tegangan permukaan gelombang mencegah solder mengalir melewati penyekat belakang.

Jika solder diaplikasikan ke papan tanpa oksigen yang cukup, maka akan turun ke kondisi gelombang. Hal ini akan menyulitkan untuk melihat solder di dalam papan, tetapi tetap akan membuat sambungan listrik. Satu solusi untuk masalah ini yaitu, menambah jumlah kabel pada papan. Atau, Anda bisa mengubah desain stensil untuk mencegah pencetakan pasta solder di luar kontak.

Penyolderan gelombang bisa membingungkan. Hal ini sudah ada bahkan sebelum kebanyakan orang dilahirkan. Terlepas dari fakta ini, banyak orang merasa sulit untuk memahami dan mengendalikannya. Untungnya, sekarang ada metode otomatis untuk penyolderan massal.